International Business Machines Corporation

Keith C O'Neil

David Clifford Long

Mark J LaPlante

Brenda Lee Peterson

John Ulrich Knickerbocker

Jon Alfred Casey

Glenn A Pomerantz

Daniel S Mackin

Cynthia J Calli

Laertis Economikos

Raschid Jose Bezama

David B Goland

Kevin M Prettyman

James G Balz

Candace A Sullivan

Kurt A Smith

Kathleen Mary McGuire

Ralph Richard Comulada, Jr

Darren T Cook

Joseph Christopher Saltarelli

Michael Thomas Puchalski

Thomas Weiss

Benjamin V Fasano

Robert Albert Meyen

Timothy Titus Popp

Charles Hampton Perry

Lester W Herron

James N Humenik

Dinesh Gupta

Jawahar P Nayak

James Ralph Case

Randall Jason Werner

Thomas P Moyer

John E Kozol

Laszlo Kando

Thomas Ramundo

Daniel T Langdon

Screening of a workpiece utilizing a screening apparatus which includes a paste dispensing apparatus and a trailing squeegee assembly in close proximity to the paste dispensing apparatus. When the screening apparatus is operable, the squeegee assembly is in contact with the workpiece at the same time as a paste is dispensed from the paste dispensing apparatus.

Screening apparatus with trailing squeegee and method of screening

A method for displacing an article using first and second pallets for holding and transporting an article between two process stations and an H-bar assembly for receiving the first and second pallets, the method including the steps of: receiving the first and second pallets and articles thereon by the H-bar assembly at one of the two process stations; performing a first process on the articles while received by the H-bar assembly; moving the first and second pallets and articles thereon to a second process station; and performing a second process on the articles while at the second process station.

Method for displacing an article during screening

An apparatus for displacing an article including first and second pallets for holding and transporting an article between two process stations; an H-bar assembly for receiving the first and second pallets at one of the two process stations; wherein, in operation, a process is performed on the articles while the first and second pallets are received by the H-bar assembly, the pallets then being transported to the second process station where a second process is performed on the articles.

Apparatus for displacing an article during screening

The present invention is a workpiece support apparatus and method of making of using the same. A holding fixture frame supports the workpiece about the perimeter and also locates the workpiece. A series of support wires keep the workpiece from sagging inside the holding fixture frame. The support wires provide support while allowing top and bottom access to the workpiece. The workpiece remains flat at the point of the machining operation.

Support apparatus for positioning a workpiece

A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.

Pre-patterned substrate layers for being personalized as needed

A punched slug removal system for punching a slug from a workpiece and removing the punched slug. The system includes a punch having a reciprocating travel path with a transition point where the punch changes direction. A die plate has an aperture into which a die bushing may be disposed. The die bushing provides support for the workpiece and has an opening through which the punch and a slug pass. A manifold supports the die plate and (if present) the die bushing and has a distribution channel and an orifice which direct a gas flow onto a slug attached to the punch in a direction perpendicular to the reciprocating travel path of the punch to remove the slug from the punch. The distribution channel is tapered to increase the velocity of the gas flow. The orifice is positioned at the top of the manifold adjacent the transition point of the reciprocating travel path of the punch. The manifold extends into the aperture of the die plate, reducing the cross sectional area of the aperture, and has a step formed under the punch. The system also includes a vacuum, offset relative to the punch and applied to the side of the punch opposite the orifice, to enhance removal of slugs from the punch.

Method for punching slug from workpiece

Conductive vias in integrated circuit ceramic greensheets are formed with essentially flat exposed surfaces by applying an adherent in situ mask material to the greensheet prior to punching via openings therethrough. The in situ mask material then serves to permit the application of a second overprint conductive paste after the original conductive paste has filled the via opening and formed a depression upon hardening. The second overprint paste fills the depression and leaves an essentially flat top surface. When the in-situ mask material is removed, a slight protuberance of conductive paste remains in a plane vacated by the in-situ mask material (with or without the second conductive paste application). In one form of the invention, this protuberance is compressed back so that it is essentially level with the surrounding ceramic greensheet by the application of pressure thereto, either by a platen or by an adjoining greensheet lamina.

Method for forming flat surface vias in integrated circuit substrates

A method for testing the integrity at least two test objects, each object is made of a plastically deformable material, by a. contacting a moving means with the objects at a first point in time, the moving means at a first position and the objects at a first position, the moving means having a shaped portion; b. shifting at least a portion of the objects to a second position at a second time, subsequent to the first time, wherein at least a portion of the objects were displaced during the interval between the first time and the second time; c. evaluating the objects after the shifting in step b. 22.

Method and apparatus for the testing of plastically deformable objects

Punched slug removal system

An apparatus and method is provided for vacuum screen printing a greensheet having vias and both vias and open areas whereby vacuum leakage in the apparatus is minimized and avoids bowing of the screen over the open area of the greensheet. An interposer apparatus is provided comprising at least two layers having vertical through openings in registration with the via openings of the greensheet and screen. The interposer also comprises vertical through openings communicating with the open area of the greensheet and with vent channels of the interposer. A porous membrane is also used either alone or in conjunction with the interposer to provide enhanced screening results.

Process for via fill

A punch tool for punching a slug from a workpiece. The punch of the punch tool has a reciprocating travel path with a transition region where the punch changes direction. A die plate of the punch tool has an aperture. A support bushing disposed in the aperture of the die plate provides support for the workpiece and has an underside and an opening through which the punch and the slug pass. A nozzle disposed in the aperture of the die plate provides an internal passage for the removal of punch slugs from the tool. The nozzle has a top and a side wall with a hole disposed in the side wall adjacent the transition region of the reciprocating travel path of the punch. The nozzle, the support bushing, and the die plate are integrated to form a flow path delivering a gas flow to the hole in the nozzle. The flow path and the hole direct the gas flow on a slug attached to the punch in the transition region of the reciprocating travel path of the punch to remove the slug from the punch.

Punch apparatus with improved slug removal efficiency

The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.

Apparatus and method for screening using electrostatic adhesion

Forming a green multi-layer component with an embedded pattern of barrier material, which may be in the form of a positive pattern to form a recessed area or in the form of a negative pattern to form raised areas on the component. Peripheral channels are machined into the green laminate surface to outline each negative or positive pattern feature, the channels being cut deep and wide enough to contact and overlap the edges of the barrier material. The layer of barrier material and the overlying layer(s) of ceramic material are separated from the remainder of the component to produce a non-planar part having raised areas in the case of a negative pattern of barrier material or a part having recessed areas in the case of a positive pattern of barrier material. An apparatus and process to control the machining depth of cut using both AC and DC sensing techniques is disclosed. The non-planar component may be provided with recessed surface metallurgy, such as seal bands and filled via connections, which can survive planarization.

Lamination process for producing non-planar substrates

The present invention relates generally to a new apparatus and method for screening using porous backing material. More particularly, the invention encompasses an apparatus that uses a porous backing material which is adhered to a green sheet during the screening process. Basically, a backing layer having a very high porosity is adhered to a green sheet, while the green sheet is screened. During the drying process of the green sheet some of the screening fluids are absorbed by the porous backing layer, which allows the screened vias of the green sheet to have a smooth surface.

Apparatus and method for screening green sheet with via hole using

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Hughsonville, NY, United States of America

Keith C O'Neil