Kemet Electronics Corporation

Keith Brown

Philip Michael Lessner

Reggie Phillips

Antony P Chacko

John Bultitude

John E McConnell

Garry L Renner

Jeffrey W Bell

Allen Hill

R Allen Hill

James B Byrd

Robert Allen Hill

John E Mcconnell

A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

Multilayered ceramic capacitor with improved lead frame attachment

A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.

Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes

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Simpsonville, SC, United States of America

Keith Brown