Motorola Corporation

Keith A Meny

Robert Charles Kosberg

David J Cottingham

Lawrence R Poglitsch

Christopher J Hoyle

Frank E Kazak

James Lee Nowicki, Jr

Chiu Chik Chen

Patrick A McGovern

An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).

Electrical device having atmospheric isolation

An electronic module assembly (50) has a bendable base plate (52) upon which circuit components (76) are mounted. A module enclosure device (56) mates with the base plate and has an integrally formed, non-removable support arm (96). During assembly, the base plate (52) is bent around the support arm (96) in a 'C' shape. Thus formed, the base plate (52) and the module enclosure device (56) form an internal cavity that holds the circuit components (76).

Electronic module assembly

Growing community of inventors

Wheeling, IL, United States of America

Keith A Meny