Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Keitaro Yamagishi

Yoshihiro Akeboshi

Hiroshi Itakura

Seiichi Saito

Tetsuro Kato

Tetsu Owada

Koji Shibuya

A transmission path design assistance system assisting in the design of a transmission path with different reflection specification values for each frequency is obtained. The transmission path design assistance system includes: an acquisition unit to acquire reflection specification values of a reflection characteristic of a transmission path to be designed and a constraint of characteristic impedance distribution of the transmission path; and a computation processing unit including: a reflection characteristic calculation unit to calculate the reflection characteristic from inputted characteristic impedance distribution; a reflection characteristic modification unit to modify, on the basis of the reflection specification values acquired by the acquisition unit, the reflection characteristic calculated by the reflection characteristic calculation unit; a characteristic impedance distribution calculation unit to calculate characteristic impedance distribution from the reflection characteristic modified by the reflection characteristic modification unit; and a characteristic impedance distribution modification unit to modify, on the basis of the constraint acquired by the acquisition unit, the characteristic impedance distribution calculated by the characteristic impedance distribution calculation unit and output it to the reflection characteristic calculation unit.

Transmission path design assistance system, transmission path design assistance method, and computer readable medium storing transmission path design assistance program

There are included a CAN package () having a stem () and lead pins (and) protruding from the stem (), and a board () having pads (and) for connecting lead pin. The CAN package () has a slot () provided in a surface of the stem () from which the lead pins (and) protrude. One end of the board () is inserted into the slot (), and the pads (and) for connecting lead pin are electrically connected to the lead pins (and).

Optical module

Semiconductor package

Provided is a signal transmission circuit capable of realizing the same effects as those in a conventional manner that employs a complicated circuit by using no complicated circuit, that is, by a simple circuit. The signal transmission circuit includes: a transmission path having a first impedance; a terminating resistor having a predetermined resistance; a transmission path having a second impedance, which is connected to the transmission path and the terminating resistor, the second impedance being higher than both of the first impedance and the predetermined resistance; and an input buffer for receiving a signal at a connection portion of the transmission path and the transmission path.

Signal transmission circuit, IC package, and mounting board

When a change of an output signal is detected by an output-signal-state-change detector, a continuous-change performing part controls an output impedance changing part, which is provided between an output buffer and a signal line, so as to continuously change an output impedance from low impedance to high impedance, at the changing timing of the output signal.

Growing community of inventors

Tokyo, Japan

Keitaro Yamagishi