Tohoku Seiki Industries, Ltd.

Happyjapan, Inc.

Happy Industrial Corporation

Keitaro Harada

Masayoshi Yokoo

Shouhei Matsumoto

Satoshi Ueno

Norikazu Kainuma

Koichi Yoshida

Yoshinobu Takano

Yoshinori Arai

Mitsuo Koizumi

Isao Tanikawa

Mitsuyoshi Takauchi

Akio Murakami

Shinichi Hasebe

Masanobu Kusunoki

Katsuya Wakaki

Fumiaki Togashi

Shigeo Onuma

An IC deviceof the present invention includes a robot armfor conveying IC devices D to a test headfor testing the IC devices. The test headincludes socketshaving placement surfacesonto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot armincludes a contact headfor holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meterthat moves in association with the movement of the contact head. The non-contact displacement meteris mounted on the robot armso as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces

IC test system

An IC handler () of the present invention is provided with: a contact head (), which holds a plurality of IC devices, and which presses the IC devices to a plurality of sockets (); and a movable arm () that moves the contact head (). The movable arm () has power supply ports (VO, HO) that are connected to supply sources (VS, HS) of power for generating operations of the contact head (), and the contact head () has a plurality of operating sections () that operate with the power, and a supporting section (), which supports the operating sections (), and which is removably attached to the movable arm (). The supporting section () of the contact head () has: connecting ports (VC, HC) that are removably connected to the supply ports (VO, HO); and supply paths () for supplying the power to the operating sections () from the connecting ports (VC, HC) connected to the supply ports (VO, HO).

IC handler

An IC handler () of the present invention transfers an IC device (D) to a test head (). The test head () is provided with a socket (), which has a placing surface () having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface () to the test head (). The IC handler () is provided with a non-contact displacement meter () that is disposed by being spaced apart from the socket () in the direction perpendicular to the placing surface (). The non-contact displacement meter () measures a distance from the non-contact displacement meter () to the IC device (D) placed on the placing surface () by emitting a laser beam toward the placing surface () of the socket ().

This is a thin film forming apparatus which is equipped with a target constructed of a thin film material, a cathode for generating a particulate thin film material from the target, a supporting member for supporting the substrate on which the particulate thin film material is to be deposited, a heater for heating the substrate, and a guide for introducing the particulate thin film material onto a surface of the substrate where the thin film material is deposited, wherein the supporting member supports the substrate so as to expose the first principal surface and its backside (second principal surface) of the substrate, the target is disposed in a position for producing the particulate thin film material in an extension of the first principal surface of the substrate, and the guide is disposed on the first principal surface and the second principal surface of the substrate.

Process for forming thin film and system for forming thin film

Sewing machine

When current collecting wires are laid in parallel with each other on a solar cell on which a photosensitive film is formed, a wire tension adjusting mechanism is provided which includes a bobbin holder shaft pivotally held on the side of a frame in a bobbin cassette in a wiring apparatus and a wire bobbin is detachably fixed on the bobbin holder shaft. The wire tension adjusting mechanism further includes a pre-load means for adjusting the torque of the bobbin holder shaft and the tension of each current collecting wire to be drawn out from the wire bobbin held by the bobbin shaft is adjusted.

Wire bobbin holder of bobbin cassette in wiring apparatus

A magnetron sputtering system generates a high density plasma on a target by applying magnetic fields intersecting an electric field by using a plurality of magnets that are rotatably supported. The respective magnets are revolved and rotated so that the time variation of regions where a magnetic field (line of magnetic force) generated by the each magnet is orthogonal to an electric field is prevented from becoming monotonous. Further, the respective magnets are arranged to make the distances between the center of rotation and the center of revolution of the respective magnets different from each other, so that the regions where the magnetic field (line of magnetic force) generated by the each magnet is orthogonal to the electric field are dispersed in the radial direction of a target.

Sputtering system

A device-positioning pedestal capable of positioning devices of different sizes. The device-positioning pedestal comprises a plurality of guide members corresponding to the sides of the device and coming in contact with the sides of the device to position the device, at least one guide member includes a slide mechanism that supports the guide member so as to slide relative to the device-positioning pedestal member and a fixing mechanism that fixes the guide members at desired positions. The guide members are set to be adapted to the size of the device by the guide member-adjusting means separate from the device-positioning pedestal. The guide member-adjusting means adjust the position of the guide members based on the size of the device measured by device size-measuring means separate from the guide member-adjusting means or based on the data of data-recording means attached to the device-positioning pedestal.

Device-positioning pedestal and handler having the device-positioning pedestal

A sewing machine includes a vertical portion and a horizontal portion of an arm having at least one sewing needle mounted thereon, a bed extending in parallel to and under the horizontal portion of the arm, two first rails extending parallel to the bed in the neighborhood of the side portion of the vertical portion, first carriages adapted to slide on the first rails, and a second rail connected to the first carriages and perpendicular to the first rails, wherein the distance between the two first rails is shorter or equal to the length of the second rail. The sewing machine includes a second carriage adapted to slide on the second rail, and an embroidery frame unit mounted on the second carriage, wherein the sewing machine is capable of embroidery without being limited by the distance between the rails.

A disk ( ) is horizontally rotated a half-turn by a motor ( ) in a rotational direction and, then, is rotated a half-turn in an opposite rotational direction. Two servomotors ( ) are symmetrically disposed, on an upper surface of the disk ( ), with respect to a rotating shaft of the disk ( ). Driving shafts ( ), driven by the two servomotors ( ), downwardly extend through the disk ( ), and move hanging members (K, M), respectively, in upward-and-downward directions. Two hanging members (K, M) are provided, at their lower ends, with clampers ( ), respectively. The clampers ( ) are each provided, at their bottom surfaces, with a suction pad ( ), and are provided, at their upper surfaces, with pneumatic cylinders ( ). The pressure of the compressed air supplied to the pneumatic cylinder is adjusted by a pressure regulating device ( ).

Growing community of inventors

Yamagata, Japan

Keitaro Harada