Panasonic Intellectual Property Management Co., Ltd.

Keitaro Fujii

Masayuki Takahashi

Yuji Yamamoto

Teppei Iwase

Nobuyuki Kamikihara

Tosihiko Wada

A learning device includes a learning unit that executes learning of determining a corrected polishing condition by updating an action value function based on state information including at least one polishing condition and a calculation result calculated based on at least one measured value during polishing.

Polishing system, learning device, and learning method of learning device

An adjustment device of a punching device punches a workpiece on a die so that the workpiece is punched into a predetermined shape. The adjustment device includes a first drive mechanism that moves the punch or the die in a direction orthogonal to a punching direction, and a controller connected to the first drive mechanism. The controller brings the punch and the die into contact with each other by moving the punch or the die in four orthogonal directions in a plane perpendicular to the punching direction from an initial position where the punch is inserted into the punching die. The controller causes the first drive mechanism to move the punch or the die to a center position where a central axis of the punch and a central axis of the die are aligned with other.

Adjustment device of punching device and adjustment method of punching device

There is provided a punching device for punching a workpiece into a predetermined shape using a die and a punch, the device including: load sensors which measure a load in a punching direction at at least three predetermined points different from each other; and a control device that calculates a first moment, which is a sum of moments of the measured load around a first axis, and a second moment, which is a sum of moments of the measured load around a second axis, with respect to the first and second axes on a plane perpendicular to the punching direction, and determines that foreign matter is generated in a case where a magnitude of at least one of the first and second moments is deviated from a range of predetermined values.

Punching device

A learning device includes an input processor and a learning processor. The input processor acquires a physical quantity related to a cutting process, and inputs a state variable based on the physical quantity to the learning processor, and the learning processor updates, based on a measured cutting result, an evaluation model that outputs an evaluation result of the cutting process based on the state variable.

Learning device and cutting process evaluation system

A film structural member includes a recessed portion on a transparent substrate, metal wiring on a base of the recessed portion, and a particle layer on the metal wiring. The particle layer is configured as an aggregate of particles having an average particle diameter of 300 nm or smaller.

Growing community of inventors

Osaka, Japan

Keitaro Fujii