Shinko Electric Industries Co., Ltd.

Keita Sato

Masahiro Sunohara

Yuichi Nakamura

Ayako Sakai

Yohei Yamada

A substrate fixing device includes a base plate having a first through-hole penetrating through the base plate in a thickness direction of the base plate, a ceramic plate adhering to the base plate, having an electrode embedded in the ceramic plate and a second through-hole formed to communicate with the first through-hole, and configured to adsorb an adsorption target object by an electrostatic force that is generated when a voltage is applied to the electrode, an insulating plug arranged at a connection portion in the first through-hole connecting to the second through-hole, and a sealing member attached to the insulating plug and configured to seal a periphery of the connection portion.

Substrate fixing device

An electrostatic chuck includes a base plate, a ceramic plate fixed to the base plate and including an electrode embedded in the ceramic plate, and a resin layer bonding the base plate and the ceramic plate and including one or more adhesives. In at least one of the one or more adhesives, a temperature corresponding to an extreme value of a loss tangent in a temperature range of −150° C. to 250° C. is −70° C. or lower.

Electrostatic chuck

A columnar metal component includes a first main surface, and a second main surface on an opposite side to the first main surface. The first main surface includes a first groove. The metal component includes a through-hole penetrating the metal component from the first main surface to the second main surface.

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Nagano, Japan

Keita Sato