Hitachi-high-technologies Corporation

Hitachi, Ltd.

Hitachi High-tech Corporation

Keita Nogi

Teruo Nakata

Hideaki Kondo

Satomi Inoue

Susumu Tauchi

Michinori Kawaguchi

Yoshiro Suemitsu

Daisuke Shiraishi

Akira Kagoshima

Atsushi Shimoda

Satoshi Fukuda

Shota Umeda

Takafumi Chida

A system performs a loss factor determination which refers to, for each of two or more different Ms from among 4 Ms (Man, Machine, Material, and Method), a time series data group representing a time series of a state of an element belonging to the M, and which determines, for each period between time points, whether or not a state combination in the same period between time points corresponds to one or a plurality of loss state combinations. In each period between time points, the state combination is a combination of two or more states belonging to the period between time points and corresponding to the two or more Ms. The loss state combination is a state combination defined as an opportunity loss. With each loss state combination, a loss factor, which is a factor of an opportunity loss corresponding to the loss state combination, is associated.

Production management support system and production management support method that automatically determine loss factors

Improvement of work is instructed based on an analysis result obtained by combining data having different timescales. A productivity improvement support system includes a time scale setting unit configured to, when 4M data having different time scales acquired from a target device contains data that satisfy a condition for detecting a state fluctuation, switch time scale of the 4M data to time scales according to a state fluctuation, a loss analysis calculation unit configured to analyze a production loss factor by using analysis model data in which the production loss factor of the target device when the condition is satisfied is determined, and a recommended work selection unit configured to select a recommended work when the production loss factor occurs from one or a plurality of recommended works by using recommended work data stored in association with the production loss factor.

Productivity improvement support system and productivity improvement support method

Provided is an information processing device to estimate a current work status by using record data including Man data and a work model in which the record data and with work content at a manufacturing site are associated. The information processing device supports a production instruction at the manufacturing site, and includes a data extraction unit that acquires record data including Man data from the manufacturing site, and a work candidate calculation unit that estimates a current work status by using the record data and a work model in which the record data and with a work content at the manufacturing site are associated.

Information processing device and production instruction support method

Provided is a plasma processing apparatus including a processing unit in which a sample is plasma processed and which includes a monitor (optical emission spectroscopy) that monitors light emission of plasma, wherein the processing unit includes a prediction model storage unit that stores a prediction model predicting a plasma processing result, and a control device in which the plasma processing result is predicted by using a prediction model selected based on light emission data and device data as an indicator of state change of the processing unit.

Plasma processing apparatus

Provided is a method that may quickly and simply select the allocation of the type of wafers to the processing chamber having a higher productivity in a semiconductor processing device in which a plurality of conveyance robots is disposed in a conveyance mechanism to which a processing chamber is connected and an object to be processed is delivered between the plurality of conveyance robots, when processings are performed on a plurality of types of wafers in parallel. From the information on the arrangement of the processing chambers of the semiconductor processing device and input type of wafers to be processed, the processing chamber allocation candidate is comprehensively generated and a simulation that manufactures all processing targets for each of the processing chamber allocation candidates is performed to calculate a productivity and the candidates are displayed in the order from a higher productivity to support the adoption of a user.

Processing chamber allocation setting device and processing chamber allocation setting program

In a processing system of a linear tool in which plural carrying robots are arranged in carrying mechanical units to which processing modules are coupled and a processing target is delivered and received between the plural carrying robots, in the case where there are plural carrying routes on which the processing target is carried, the present invention provides a technique for determining the carrying route on which the highest throughput can be obtained. In the processing system of a linear tool, in the case where there are plural carrying routes on which the processing target is carried, the throughputs of the respective carrying routes are compared to each other, and the carrying route is determined by a unit for selecting the carrying route with the highest throughput.

Semiconductor processing system and program

A vacuum processing apparatus is disclosed for processing workpieces. The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum. Vacuum transport chambers are connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated. The workpiece can be transferred between each of the process chambers and the load lock via the corresponding vacuum transport chamber. The apparatus also includes load lock valves for switching between interrupt and opening between the load lock and the corresponding vacuum transport chambers, and process chamber valves for switching between interrupt and opening between the process chambers and the corresponding vacuum transport chambers. Timing for opening and closing the valves is controlled in synchronization with the transfer of the workpieces.

Vacuum processing apparatus

A method for operating a vacuum processing apparatus, the vacuum processing apparatus including: a plurality of cassette stands on which a cassette capable of housing a plurality of wafers therein can be placed; a plurality of vacuum processing vessels each having a processing chamber arranged therein, wherein the wafer is arranged and processed in the processing chamber; and at least one transport robot transporting the wafer on a transport path between either one of the plurality of cassettes and the plurality of vacuum processing vessels, the vacuum processing apparatus sequentially transporting in a predetermined transport order the plurality of wafers from either one of the plurality of cassettes to a predetermined one of the plurality of vacuum processing vessels and processing the plurality of wafers. The method includes a number determining step, a remaining-time determining step and a transport order skip step.

Operation method for vacuum processing apparatus

A vacuum processing apparatus which includes an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, and a second vacuum transfer chamber connected to the transfer intermediate chamber. At least one vacuum processing chamber is connected to the first vacuum transfer chamber, and two or more vacuum processing chambers are connected to a rear side of the second vacuum transfer chamber. A plurality of gate valves are disposed between the first vacuum transfer chamber and each of the lock chamber, the transfer intermediate chamber, and the vacuum processing chamber coupled to the first vacuum transfer chamber. A control unit is also provided for controlling operation of the gate valves.

Vacuum processing apparatus and operating method of vacuum processing apparatus

The present invention provides an efficient transferring control method in a vacuum processing apparatus of a linear tool in which plural vacuum robots are arranged in transferring mechanical units to which process chambers are connected and processing-target members are passed and received among the plural vacuum robots. In addition, the present invention provides a vacuum processing apparatus in which there are provided plural controlling methods, and a unit which determines whether rates of the transferring robots are to be controlled or rates of the process chambers are to be controlled on the basis of processing time of each processing-target member and switches the controlling method in accordance with a site whose rate is controlled.

Vacuum processing apparatus and program

An efficient method of controlling transportation in a linear tool type vacuum process device in a state that a length of time required for a process is not stable. For each process chamber, the number of unprocessed wafers that are in process or are being transported to the process chamber is counted, and in deciding a transport destination of a wafer, when the number of unprocessed wafers is equal to or larger than a charge limit amount, a transport destination of a wafer is decided excluding the process chamber. Also, a wafer holding mechanism on a transport path to a process chamber is reserved, and a transport destination of a processed member to be transported next is decided according to a status of reservation.

Vacuum process device and vacuum process method

Transportation control in a vacuum processing device with high transportation efficiency without lowering throughput is provided. A control unit is configured to update in real time and holds device state information showing an action state of each of a process chamber, a transportation mechanism unit, a buffer room, and a holding mechanism unit, the presence of a process subject member, and a process state thereof; select a transport algorithm from among transport algorithm judgment rules that are obtained by simulating in advance a plurality of transport algorithms for controlling transportation of a process subject member for each condition of a combination of the number and arrangement of the process chambers and process time of a process subject member based on the device state information and process time of the process subject member; and compute a transport destination of the process subject member based on the selected transport algorithm.

Vacuum processing device and method of transporting process subject member

Provided is a method for controlling efficient transferring operations in a vacuum processing apparatus with a linear tool. In the apparatus, plural transferring robots are arranged in transferring mechanism units in which plural process chambers are connected with each other, and to-be-processed wafers are received and passed between plural transferring robots. As the transferring robots is far from the load lock, the number of transferring operations to the process chambers is set larger, the number of times of continuous transferring operations to the process chambers is set as small as possible, and an odd number of times of continuous transferring operations to buffer rooms is set, by a destination determination unit and operation control rules. Further, transferring operations are performed based on the destination determination unit and the operation control rules.

Growing community of inventors

Tokyo, Japan

Keita Nogi