Shin-etsu Chemical Co., Ltd.

Keita Kitazawa

Kunihiro Yamada

Masataka Deguchi

Koji Nakanishi

Mitsuhiro Iwata

Wataru Toya

Takahiro Yamaguchi

Kenichi Tsuji

Kohei Masuda

Ryo Miyazaki

Ayako Yamaguchi

A thermal-conductive silicone composition containing (A) 0.5 to 2.5 mass % of a crosslinked silicone gel containing (a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, and having a kinematic viscosity at 25° C. of 10,000,000 mm/s or more, and (b) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule; (B) 12.5 to 19.5 mass % of a hydrolysable organopolysiloxane compound; and (C) 80 to 85 mass % of aluminum nitride particles having an average particle size of 0.5 pm or more and 1.5 pm or less. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the whole. The coarse particles are 10 pm or more in a particle size distribution by laser diffraction. A thermal-conductive silicone composition has excellent coating workability and favorable pumping-out resistance, and is capable of attaining low thermal resistance by being thinly compressed.

Thermal-conductive silicone composition

A thermally conductive silicone composition that has high thermal conductivity and excellent workability and misalignment resistance, and contains, in specific ratios:

Thermally conductive silicone composition and production method therefor

A thermal-conductive silicone composition containing: (A) a hydrolysable organopolysiloxane having an alkoxysilyl group; and (B) aluminum nitride particles having an average particle size of 0.5 μm or more and 2.0 μm or less and contained in an amount of 50 to 70 volume %. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the entire aluminum nitride particles, the coarse particles having particle sizes of 10 μm or more according to a particle size distribution measurement method by laser diffraction. The thermal-conductive silicone composition has a heat conductivity of 1.3 W/mK or more according to a hot disc method. The present invention provides: a thermal-conductive silicone composition having high heat conductivity and being compressible to 10 μm or less; and a production method of the thermal-conductive silicone composition.

Thermal-conductive silicone composition, production method therefor, and semiconductor device

A non-curable thermal-conductive silicone composition contains essential components of: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 1,000,000 mm/s or more in an amount of 5 to 20 mass % relative to a sum of the component (A) and a component (B); (B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) in an amount of 80 to 95 mass % relative to the sum of the components (A) and (B); and (C) a heat conductive filler in an amount of 10 to 95 mass % relative to a total amount of the composition. A mixture of the components (A) and (B) has a molecular weight distribution Mw/Mn of 10 or more. Rrepresents a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent. 'm' represents an integer of 5 to 100.

Non-curable thermal-conductive silicone composition

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm/s at 25&#xb0; C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40&#xb0; C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m&#xb7;&#xb0; C.) per 100 total parts by mass of components (A) and (B).

Silicone composition

This addition-cure silicone composition comprises (A) an organopolysiloxane that has two or more aliphatic unsaturated hydrocarbon groups per molecule and has a kinematic viscosity of 60-100,000 mm/s at 25&#xb0; C., (B) an organohydrogen polysiloxane that has two or more silicon atom-bonded hydrogen atoms per molecule, and (C) hydrosilylation catalyst particles that have a microcapsule structure in which a platinum group metal catalyst-containing organic compound or polymer compound (C') serves as a core substance, while a three-dimensional crosslinked polymer compound obtained by polymerizing at least one type of a polyfunctional monomer (C&#x2033;) serves as a wall substance, wherein [solubility parameter of (C&#x2033;)]&#x2212;[solubility parameter of (C&#x2032;)] is at least 1.0. Since the hydrosilylation catalyst particles having a specific structure are used in this addition-curable silicone composition, it is possible to prevent the silicone composition from being cured prior to the originally intended curing process when the composition is exposed to extremely high temperature exceeding 200&#xb0; C., and to maintain the activity of the hydrosilylation catalyst.

Addition-cure silicone composition

Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 &#x3bc;m or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition. A one-pack addition curable silicone composition having as essential ingredients: (A) organopolysiloxane having silicon-atom-bonded aliphatic unsaturated hydrocarbon groups and a specific kinematic viscosity; (B) one or more thermally conductive fillers selected from metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon; (C) organohydrogenpolysiloxane; and (D) a platinum group metal complex having an organic phosphorus compound represented by formula (1)R&#x2014;P&#x2014;(OR)&#x2003;&#x2003;(1)(Ris a monovalent hydrocarbon group, x is 0-3) as a ligand.

One-pack addition curable silicone composition, method for storing same, and method for curing same

This addition-curable silicone composition contains (A) an organopolysiloxane having at least two unsaturated aliphatic hydrocarbon groups in each molecule, (B) an organohydrogenpolysiloxane in an amount that provides a value of 0.5-5 for the ratio of the number of SiH groups to the total number of unsaturated aliphatic hydrocarbon groups in the component (A), and (C) an effective amount of hydrosilylation catalyst microparticles that have a microcapsule structure containing a platinum-group metal catalyst-containing organic compound or polymer compound as a core material and a three-dimensional crosslinked polymer compound obtained by polymerizing at least one polyfunctional monomer as a wall material, the platinum-group metal catalyst-containing organic compound or polymer compound having a dynamic viscosity of 10-100,000 mm/s at 25&#xb0; C.

Addition-curable silicone composition

Provided is a thermally conductive silicone composition which need not be stored with cooling or freezing and needs neither a heating nor a cooling step during mounting to bring about a high production efficiency and which gives cured objects that, during heating or cold/heat cycling, can be inhibited from suffering a change in hardness or a deterioration caused by cracking or dislocation. The composition includes a conventional condensation-curable silicone composition, and is cured by a combination of the condensation and curing with an organic peroxide.

Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction

A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G&#x2033; of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G' after 3,000 seconds from the start of holding is 10,000 Pa or less, G&#x2032; after 7,200 seconds from the start of holding is 100,000 Pa or less, and G&#x2032; exceeds G&#x2033; after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity.

Silicone composition and method for manufacturing heat-conductive silicone composition

A silicone composition that contains (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, (B) a filler containing an aluminum powder and a zinc oxide powder, (C) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule, and (D) a platinum group metal catalyst, in which a cured product of the silicone composition exhibits a ratio of a storage elastic modulus after 3,600 seconds from the start of measurement to a storage elastic modulus after 7,200 seconds from the start of measurement of 0.7 or less, the storage elastic modulus G' being measured by constructing a program for holding a sample at 150&#xb0; C. for 7,200 seconds after the sample is heated from 25&#xb0; C. to 125&#xb0; C. at a temperature increase rate of 10&#xb0; C./min, from 125&#xb0; C. to 145&#xb0; C. at a temperature increase rate of 2&#xb0; C./min, and from 145&#xb0; C. to 150&#xb0; C. at a temperature increase rate of 0.5&#xb0; C./min.

Heat-conductive silicone composition

A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G&#x2033; of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G' after 3,000 seconds from the start of holding is 10,000 Pa or less, G&#x2032; after 7,200 seconds from the start of holding is 100,000 Pa or less, and G&#x2032; exceeds G&#x2033; after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.

Provided are: a novel organopolysiloxane compound containing a vinylene group, which can be used as a base polymer for an addition-curable silicone composition, particularly an organopolysiloxane compound containing a terminal vinylene group; and a method for producing the organopolysiloxane compound. An organopolysiloxane compound characterized by having at least one unit represented by formula (1) as a partial structure, and also characterized by being linear or branched. [R's independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms; R's independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, or a group represented by formula (a); x represents an integer of 0 to 1,998; R's independently represent a group represented by formula (a); R's independently represent a monovalent hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 2,000; and b represents an integer of 0 to 1,999.]

Organopolysiloxane compound and method for producing the same, and addition-curable silicone composition

Provided is a silicone composition exhibiting a favorable adhesiveness even when containing a large amount of a thermal conductive filler. The silicone composition contains specific amounts of 

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Annaka, Japan

Keita Kitazawa