Dai Nippon Printing Co., Ltd.

Keita Arihara

Atsuo Tsuzuki

Naoto Yamanaka

Hitoshi Nishikawa

Katsuya Sakayori

Koji Ichimura

Shunji Fukuda

Kei Amagai

Marii Nishikawa

Yasushi Shirahige

Seiichi Yoshimi

Atsushi Nakahara

Yuji Matsumoto

A backside protective sheet for solar cell modules includes a first layer configured to reflect near-infrared light, a first colored layer arranged closer to a light-receiving surface than the first layer and configured to transmit near-infrared light, and a second colored layer arranged closer to the light-receiving surface than the first colored layer and configured to transmit near-infrared light.

Backside protective sheet for solar cell modules and solar cell module

In order to satisfy the demand of consumers regarding design attractiveness, an infrared-light-transmitting dark color ink is provided, the ink having a black appearance and attaining high design attractiveness and, despite this, having sufficient infrared-light-transmitting property. The infrared-light-transmitting dark color ink transmits near infrared light having wavelengths of 750-1,500 nm, and comprises a resin component and a pigment component that comprises both a brown pigment, e.g., a benzimidazolone pigment, and a phthalocyanine pigment.

Infrared-light-transmitting ink of dark color, and infrared-light-reflecting sheet obtained using same

A diffusion member includes a first layer and a second layer, in this order, wherein the first layer has a light transmissivity and a light diffusivity, in the second layer, a reflectance of light increases as an absolute value of an incident angle with respect to a first layer side surface of the second layer decreases, and a transmittance of light increases as an absolute value of an incident angle with respect to a first layer side surface of the second layer increases.

Diffusion member, stacked body, diffusion member set, LED backlight, and displaying apparatus

An encapsulant sheet suitable for encapsulating a light-emitting element in, for example, a self-luminous display or for direct backlights. The encapsulant sheet is a single-layer or multi-layer resin sheet that includes an adhesive layer exposed at a topmost surface. The Vicat softening point is greater than 60&#xb0; C. and no higher than 100&#xb0; C. The melt viscosity of the encapsulant sheet, at a shear velocity of 2.43&#xd7;10 secand measured at a temperature of 120&#xb0; C. is at least 5.0&#xd7;10poise and no more than 1.0&#xd7;10poise. The adhesive layer contains a polyolefin and a silane component, and a content of the silane component relative to the resin component of the adhesive layer is at least 0.03% by mass and less than 10% by mass.

Encapsulant sheet for self-luminous display or encapsulant sheet for direct backlight, self-luminous display, and direct backlight

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43&#xd7;10 secand measured at a temperature of 120&#xb0; C., being 5.0&#xd7;10poise to 1.0&#xd7;10poise inclusive.

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43&#xd7;10 sec-1 and measured at a temperature of 120&#xb0; C., being 5.0&#xd7;103 poise to 1.0&#xd7;105 poise inclusive.

Disclosed is a substrate for a flexible device which, when a TFT is produced on a flexible substrate in which a metal layer and a polyimide layer are laminated, can suppress deterioration of the electrical performance of the TFT due to the surface irregularities of the metal foil surface and can suppress detachment or cracks of the TFT. Also disclosed is a substrate for a thin film element which has excellent surface smoothness and is capable of suppressing deterioration of the characteristics of thin film elements. Also disclosed are methods for manufacturing substrates for thin film elements.

Substrate for flexible device, thin film transistor substrate for flexible device, flexible device, substrate for thin film element, thin film element, thin film transistor, method for manufacturing substrate for thin film element, method for manufacturing thin film element, and method for manufacturing thin film transistor

Growing community of inventors

Tokyo, Japan

Keita Arihara