Kabushiki Kaisha Yaskawa Denki

Fujitsu Corporation

Keisuke Yoshino

Mitsuaki Hagio

Shin Osaki

Shinichi Kuranari

Atsushi Tsukazoe

Yoshihiro Kusama

Tatsuya Tanoue

Ryuichi Ebuchi

Shuang Xu

Mari Hamachi

Takeshi Yagyu

Koichi Nakahama

Tatsuyuki Urata

Marie Kawano

An alignment apparatus includes a rotational support configured to rotate around a central axis, a rotation actuator, an edge sensor, and control circuitry. The rotational support includes substrate supports configured to concurrently support a substrate, and ring supports configured to concurrently support a focus ring. The rotation actuator is configured to rotate the rotational support around the central axis. The edge sensor is configured to generate an edge signal that changes in accordance with each of an edge position of the substrate and an edge position of the focus ring. The control circuitry is configured to control the rotation actuator to adjust a posture of the substrate to a first target posture based on the edge signal, and to control the rotation actuator to adjust a posture of the focus ring to a second target posture based on the edge signal.

Alignment and transport of substrate and focus ring

A wireless communication system includes: a first wireless communication terminal to register an external device, wherein a subscriber information management device transmits a location of the external device to the first wireless communication terminal based on a search result of the external device based on a search request for the external device, the search request being transmitted from the subscriber information management device to a second wireless communication terminal within a search target area, the second wireless communication terminal being identified by the subscriber information management device based on registration information including certain information and location information of the external device.

Wireless communication system, wireless communication terminal, and subscriber information management device

In a preferred embodiment, an aligner includes a grip mechanism provided with a plurality of damp arms for holding an external periphery of a wafer; a rotary mechanism for rotating the grip mechanism to rotate the wafer in a prescribed rotational direction, and a lifter mechanism provided with a plurality of lift arms for lifting up the wafer above the grip mechanism. The aligner is configured to align the wafer by the grip operation of the grip mechanism and the rotary operation of the rotary mechanism, and one or more of the plurality of the lift arms which interfere with one or more of the plurality of clamp arms at the time of lifting up the plurality of lift arms are engaged with restriction members provided on the grip mechanism to prevent an upward movement thereof.

Aligner, wafer transferring device, and semiconductor production device

It is an object to provide an aligner for centering a wafer and adjusting an angle of a notch or the like of the wafer while gripping edges of the wafer capable of attaining a shortened takt time and miniaturization of the apparatus by employing a mechanism capable of infinite rotation without being restricted by a rotational range, by eliminating cables and/or tubes at the rotating portion. The link mechanism for causing opening and closing movements of the gripping mechanism for gripping a waferis supported via a bearingwith respect to the link mechanism driving portion for driving the link mechanism so that only the gripping portion and the link mechanism can be rotated.

Aligner

Growing community of inventors

Fukuoka, Japan

Keisuke Yoshino