Nichia Corporation

Keisuke Sejiki

Kunihito Sugimoto

Daisuke Sanga

Nobuhide Kasae

Tsukasa Tokida

Dai Wakamatsu

Tomonori Morizumi

Takuya Okada

Naoki Azuma

Takao Kosugi

Shinpei Maeda

The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.

Molded package for light emitting device

Provided is a bandpass filter for a light emitting device that can improve the light emission efficiency in use for a light emitting device, and a light emitting device that can obtain the high light emission efficiency by using the bandpass filter. The light emitting device includes a substrate; a light emitting element disposed over the substrate; a phosphor-containing layer containing at least one kind of phosphor; and a bandpass filter disposed over a surface of the phosphor-containing layer on the light emitting element side, the bandpass filter including a multilayer film having a plurality of first and second dielectric layers, the second dielectric layer being disposed over the first dielectric layer. The bandpass filter has a transmittance of 60% or more for light having a light emission peak wavelength of the light emitting element at an incident angle of 0 to 85&#xb0;, and another transmittance of 40% or less for light having a light emission peak wavelength of at least one kind of phosphor at an incident angle of a Brewster's angle (&#x3b8;)+5&#xb0; (&#x3b8;+5&#xb0;) to 85&#xb0; of the bandpass filter.

Bandpass filter for use in light emitting device and light emitting device using the same

A light emitting device includes a light emitting element whose upper surface is a light extraction surface, and a light-transmissive member that has an upper surface and a lower surface, and covers the light extraction surface of the light emitting element. The light-transmissive member contains a phosphor. The upper surface and the lower surface of the light-transmissive member are both flat surfaces and parallel to each other. A side surface of the light-transmissive member has a protruding portion that protrudes to the side and has contact with the lower surface.

Light emitting device

A molded package, comprising: a molded resin having a recess for accommodating a light emitting element; a ceramic substrate disposed in a bottom of the recess, the ceramic substrate having one surface exposed from the bottom of the recess and the other surface exposed from a rear surface of the molded resin; and a lead disposed at a lower part of the molded resin, the light emitting element being mounted on the one surface of the ceramic substrate, the lead being in contact with at least one side surface of the ceramic substrate to hold the ceramic substrate.

Molded package for light emitting device and light emitting device using the same

The light emitting device comprising a light emitting element; and a wavelength converting member having a first face and a second face, in which light emitted from the light emitting element enters in through the first face, and a part of the second face serves as a light emitting face, wherein the light emitting element further comprises a reflection control structure around the light emitting face of the second face, and the reflection control structure comprises a reflection film on the wavelength converting member and an anti-reflection film on the reflection film.

Growing community of inventors

Tokushima, Japan

Keisuke Sejiki