Ebara Corporation

Keisuke Sakata

Nobuyuki Takahashi

Hozumi Yasuda

Katsuhide Watanabe

Itsuki Kobata

Nobuyuki Takada

Takamasa Nakamura

Yuji Yagi

Akio Yanai

Yasuhiro Takada

A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.

Polishing head system and polishing apparatus

A polishing apparatus which can perform power supply, signal transmission, and communication in a non-contact type to respective equipments in a polishing head and/or a polishing table by providing a non-contact type transmission connector having no physical contact point on at least one of the polishing head and the polishing table is disclosed. The polishing apparatus includes a non-contact transmission connector provided on at least one of the polishing table and the polishing head and configured to transfer electric power or signals or to perform communication between a stationary unit and a rotating unit which face each other in a non-contact manner. The electric power or the signals are transmitted or communication is performed between equipment provided in at least one of the polishing table and the polishing head, and the outside of the polishing table or the polishing head through the non-contact transmission connector.

Polishing apparatus

Growing community of inventors

Tokyo, Japan

Keisuke Sakata