Hitachi Chemical Company, Ltd.

Keisuke Ookubo

Teiichi Inada

Akira Nagai

Atsushi Takahashi

Tomoaki Shibata

Kazutaka Honda

Tetsuya Enomoto

Tetsurou Iwakura

Emi Miyazawa

A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device

The present invention provides an adhesive composition for an optical waveguide which comprises (a) an epoxy resin, (b) a curing agent and (c) a high molecular compound, in which a total light transmittance and a light transmittance in a wavelength of 700 to 1600 nm in a cured matter of the adhesive composition are 80% or more and in which a transparency is consistent with a heat resistance, an adhesive film for an optical waveguide prepared by forming the above adhesive composition into a film form, an adhesive sheet for an optical waveguide comprising the above adhesive composition and a supporting base material and an optical device produced by using them.

Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them

An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises:

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises: a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups; an epoxy resin (B); a phenolic epoxy resin curing agent (C); a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250&#xb0; C. or more; and a photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.

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Ichihara, Japan

Keisuke Ookubo