Fujibo Holdings, Inc.

Keisuke Ochi

Ryuma Matsuoka

Teppei Tateno

Yoshihide Kawamura

Yamato Takamizawa

Satsuki Narushima

Tetsuaki Kawasaki

A polishing pad contains: a polishing layer having a polishing surface for polishing a workpiece; and a cushion layer disposed on the side of the polishing layer opposite from the polishing surface. With regard to the ratio (tan δ) of the storage elastic modulus E' to the loss elastic modulus E″ of the whole polishing pad, as obtained through dynamic viscoelasticity measurement using frequency dispersion (25° C.) in a bending mode, the ratio of the maximum value of tan δ measured at 100-1000 rad/s (tan δ) to the maximum value of tan δ measured at 1 to 10 rad/s (tan δ) is 0.75 to 1.30.

Growing community of inventors

Saijo, Japan

Keisuke Ochi