Denso Corporation

Keisuke Mizushiri

Akira Nakasaka

Satoshi Yamaura

A power conversion apparatus includes a plurality of semiconductor modules each having a semiconductor element integrated thereto; a plurality of cooling pipes that cools the semiconductor modules; a plurality of dummy modules with no integrated semiconductor element; and a pair of DC bus bars that constitute a current path between a DC power source and respective semiconductor modules. The semiconductor modules or the dummy modules, and the cooling pipes are alternately stacked to form a stack; m the plurality of semiconductor modules constitute an inverter circuit that converts a DC power supplied from the DC power source into a multi-phase AC power in which a plurality of types of AC outputs having mutually different phases are combined; and the dummy modules are each interposed between two semiconductor modules having mutually different phases of the AC outputs.

Power conversion apparatus

A press member which has a given length for pressing a semiconductor stack unit. The press member includes supported portions with which supporting members are placed in contact and which are arranged in a lengthwise direction of the press member, a spring which is curved in a convex shape and bulges away from contacts of the supporting members with the supported portions, and load-exerted portions which are arranged outside the supported portions in the lengthwise direction of the press member and capable of being subjected to mechanical load to elastically deform the spring, thereby shifting the supported portions. At least one of the load-exerted portions has a cut-out formed by cutting away a portion of the plate, thereby avoiding a physical interference of the press member with peripheral members and ensuring a desired degree of stroke and durability of the press member.

Press member for semiconductor stack unit

An electric power conversion device has semiconductor modules, a main P bus bar, a main N bus bar, a capacitor module, an input P bus bar and an input N bus bar. The input N bus bar is connected to the DC power source. The main N bus bar is connected to a negative electrode terminal of the semiconductor module to supply the DC power. A capacitor N bus bar, a filter capacitor and a smoothing capacitor in the capacitor module are molded by capacitor molded resin. The capacitor N bus bar is connected to a negative electrode terminal of the filter capacitor. The input N bus bar has a first N connection section connected to the capacitor N bus bar and a second N connection section connected to the main N bus bar. The main N bus bar is arranged outside of the capacitor mold resin.

Growing community of inventors

Kariya, Japan

Keisuke Mizushiri