Panasonic Corporation

Keisuke Kodera

Toshiyuki Fukuda

Toshihiro Miyoshi

Fumito Itou

Hiroshi Sonobe

Tomomitsu Masuda

Masayuki Motohama

An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do.

Electronic component module and an assembly including the same

A semiconductor device includes an insulating film formed on a substrate; an interconnect layer including a plurality of interconnects formed in the insulating film; and a pad formed on the insulating film. In a region containing at least a part of a section below the pad, a narrow spacing region is formed, where a spacing between the adjacent interconnects is shorter than that in a section outside the region containing at least a part of the section below the pad.

Semiconductor device

In a semiconductor integrated circuit, one of two signals generated from a first logic circuit is delayed in a first delay addition circuit, looped back by an input/output terminal, and then inputted to a second logic circuit. The other output of the first logic circuit is looped back by a reference input/output terminal, further delayed in a second delay addition circuit, and then inputted to the second logic circuit. By varying respective amounts of delay added by the first and second delay addition circuits from each other, AC timing specifications are satisfied and it is determined whether or not the semiconductor integrated circuit has passed a test based on whether or not the output of the second logic circuits is a desired signal relative to the input of the first logic circuit.

Growing community of inventors

Hyogo, Japan

Keisuke Kodera