Murata Manufacturing Co., Ltd.

Keisuke Ikeno

Kuniaki Yosui

Yuki Ito

Shigeru Tago

Hirohumi Shinagawa

A component-mounted resin substrate includes a thermoplastic resin substrate and an electronic component. The resin substrate includes a surface including a mounting land conductor and a reinforcing resin member. A bump of the electronic component is joined to the mounting land conductor by ultrasonic joining. The reinforcing resin member is in contact with a side surface of the mounting land conductor and has a height smaller than a height of the mounting land conductor.

Resin substrate, component-mounted resin substrate, method of manufacturing resin substrate, and method of manufacturing component-mounted resin substrate

A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.

Resin multilayer substrate and method of manufacturing the same

A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly and being in a floating state. When the element assembly is viewed from a normal direction that is normal to the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances Dto Dn is defined as an average Dave, and when the element assembly is viewed from the normal direction, an area within a circle with a center on the m-th external electrode and with a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am with a radius of Dm smaller than the average Dave when viewed from the normal direction.

Multilayer substrate, component mounted board, and method for producing component mounted board

A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly in a floating state. When the element assembly is viewed from a normal direction of the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances Dto Dn is defined as an average Dave, and an area within a circle having a center on the m-th external electrode and having a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am having a radius of Dm greater than the average Dave when viewed from the normal direction.

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Nagaokakyo, Japan

Keisuke Ikeno