Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi Power Semiconductor Device, Ltd.

Hitachi Building Systems Co., Ltd.

Keisuke Horiuchi

Kinya Nakatsu

Hideki Miyazaki

Mutsuhiro Mori

Ryuichi Saito

Toshiya Satoh

Takeshi Tokuyama

Atsuo Nishihara

Osamu Suzuki

Michiaki Hiyoshi

Sunao Funakoshi

Morio Kuwano

Yosuke Yasuda

Yosei Hara

Hiroshi Hozoji

Koji Sasaki

Hisashi Tanie

Kiyoshi Nakata

Fusanori Nishikimi

Hideyo Suzuki

Katsunori Azuma

Kenichiro Nakajima

Yuichiro Konishi

Noriyoshi Urushiwara

Yasuhiro Nemoto

Katsuaki Saito

Masamitsu Inaba

Takehide Yokozuka

Atsushi Yukita

Shuichi Terakado

Daisuke Kawase

Tomoo Hayashi

Yu Harubeppu

Takayuki Kushima

Kiyoshi Terasawa

Emi Onuma

Kentarou Mae

A power conversion device achieves size reduction and reliability by reducing the number of components of the system. The power conversion device has a semiconductor module of a half-bridge configuration in which two semiconductor elements are arranged in series. The semiconductor module has a cuboidal shape and has, along a longitudinal direction thereof, a positive pole terminal, a negative pole terminal, and terminals for inputting or outputting alternating current or for forming a single phase of the power conversion device. In the vertical direction corresponding to a widthwise direction of the cuboid, a plurality of the semiconductor modules are arranged vertically, forming a plurality of phases of the power conversion device. The semiconductor modules of the plurality of phases are installed in contact with a cooling unit, and one or more capacitors are disposed so as to face the cooling unit across the semiconductor modules of the plurality of phases.

Power conversion device and electric railroad vehicle equipped with power conversion device

An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Electric power conversion apparatus

A semiconductor power module with which it is possible to suppress the influence of noise given from a main terminal to a control terminal is provided. At least any one of main terminals (positive electrode terminal, negative electrode terminal, alternating current terminal) is so configured that the main terminal includes two parts extended in a common direction. The two parts are, for example, formed of a single component having such as a shape that the component is bifurcated from the outside toward the inside of the semiconductor power module or two different components. The two parts are so structured that the parts are extended in a common direction. Control terminals (gate signal terminal and emitter signal terminal) are so arranged that a laminated portion of the control terminals is sandwiched between one and the other of the two parts to configure the semiconductor power module.

Semiconductor power module and power conversion apparatus using the same

When the power is normally supplied from the commercial power supply, the storage battery is charged by reducing the DC voltage by the charge/discharge chopper. The switching unit is provided in the previous stage of the converter. When the commercial power supply is in an abnormal state, the three-phase AC converter is operated as three discharge choppers connected in parallel by supplying the power of the storage battery to the converter and boosting the power by the switching element included in the converter. The power of the storage battery is boosted by the charge/discharge chopper, and a part of the discharging power is supplied. One three-phase AC reactor is provided in the previous stage of the converter, and the three-phase AC reactor has three coils, magnetic leg iron cores having the coils winding around them, and one leg without a coil winding around it connected in parallel.

Uninterruptible power-supply system

A power converter includes a power semiconductor module, a first flow path forming body and a second flow path forming body that forms a housing space for storing the power semiconductor module and the first flow path forming body, in which the first flow path forming body is configured of a first side wall section, a second side wall section, and a bottom surface section, the first side wall section forms a first flow path space between one surface of the power semiconductor module and the first side wall section, the second side wall section forms a second flow path space between the other surface of the power semiconductor module and the second side wall section, and cooling refrigerant flows through the housing space, the first flow path space, and the second flow path space.

Power converter

A power conversion apparatus includes: a power semiconductor module (); a flow channel forming body () for housing the power semiconductor module (); and a cover () for fixing the power semiconductor module () to the flow channel forming body (), and the power semiconductor module () includes a power semiconductor element, main terminals () electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover () has a recessed portion () and an opening () provided in a bottom surface portion of the recessed portion (), the power semiconductor module () is placed to be fitted into the recessed portion (), the power semiconductor module () is fixed to the cover () so that the main terminals () pass through the opening (), the case and an inner wall of the recessed portion () have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a double-sided cooling structure and outflow of the coolant to outside of the module.

Power conversion apparatus

A power conversion device includes: a cooling basein which a flow passagethrough which a cooling medium flows is formed and an opening portionwhich is communicated with the flow passageis formed; a power module; and a flow passage control portion. The power modulehas a bottomed cylindrical portionin which a power semiconductor element is housed and which is inserted into the flow passagethrough the opening portion, a flange portionwhich is formed on an opening of the cylindrical portionand is fixed to the cooling baseso as to close the opening portion, and a group of radiator finswhich are mounted on an outer peripheral surface of the cylindrical portionwith a gap of a predetermined distance formed between the flange portionand the group of radiator fins. The flow passage control portionis arranged in a gap formed between the flange portionand the group of radiator fins, and introduces the cooling medium into the group of radiator finswhile preventing the cooling medium from flowing into gaps

Power conversion device

The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base, semiconductor circuitswhich are arranged on the base, and a cooling finwhich cools each of the semiconductor circuits, in which one or more protruding portionsare formed on the base, widths of the protruding portionsin a direction parallel to the basesurface being longer than a thickness of the base, thereby providing power semiconductor deviceswhich have a light weight, high heat dissipation efficiency, and high rigidity.

Power semiconductor device

A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.

Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle

In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

Semiconductor power module, inverter/converter including the same, and method of manufacturing a cooling jacket for semiconductor power module

Growing community of inventors

Hitachinaka, Japan

Keisuke Horiuchi