Ebara Corporation

Keisuke Hayabusa

Hiroshi Yakuwa

Motohiko Nohmi

Yasuhiko Saijo

Masanori Hayase

Hiroaki Nakamoto

Yuya Touke

To provide an erosion characteristics database and a method for constructing the same, an erosion prediction method and an erosion prediction system using the database for predicting a widespread erosion amount of a fluid machine or the like in a short time without the need for an operation of a model machine or an actual machine. A method for predicting erosion of a fluid machine surface due to cavitation, the method including: calculating erosion intensity distribution in each area of the fluid machine surface from cavitation flow field characteristics obtained using cavitation CFD in a flow path formed by the fluid machine; determining radius distribution and center position distribution of a representative sphere and the number of shape deformations by the representative sphere for assuming an erosion surface having a porous surface property based on the erosion intensity distribution; determining a fluid machine surface to be predicted as an approximate erosion surface; and calculating a shape after deformation of the approximate erosion surface based on the radius distribution and the center position of the representative sphere and the number of shape deformations by the representative sphere.

Erosion prediction method, erosion prediction system, erosion characteristics database used in this prediction, and method for constructing the same

A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.

Substrate plating method and apparatus

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Tokyo, Japan

Keisuke Hayabusa