Fujitsu Corporation

Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Keisuke Fukuda

Shigeyuki Maruyama

Kazuhiro Tashiro

Naohito Kohashi

Takumi Kumatabara

Daisuke Koizumi

Naoyuki Watanabe

Yuzo Shimobeppu

Naohisa Matsushita

Masayuki Imakado

Takao Ohno

Hiroshi Nozawa

Koichi Meguro

Kyohei Tamaki

Shigeru Kamada

A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Method of semiconductor device protection

A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Semiconductor device packaging structure

Method of semiconductor device protection, package of semiconductor device

A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.

Contactor for electronic components and test method using the same

Semiconductor device protection cover, and semiconductor device unit including the cover

Contact electrodes having a predetermined shape are formed by irradiating a laser beam onto the contact electrodes that are formed of a conductive material. The laser beam can be irradiated, after joining an end of each contact electrode opposite to a contact end to a contact board, so as to deform the contact electrode so that the contact end is located at a predetermined position. The laser beam may be irradiated while heating or cooling a portion of the contact electrode opposite to a portion onto which the laser beam is irradiated.

Contactor having contact electrodes formed by laser processing

A semiconductor device is manufactured by an integrated circuit forming process, and a series of subsequent steps. In the series of steps, a protection tape is adhered onto a first surface of a semiconductor substrate on which a plurality of semiconductor elements are formed, and the second surface of the semiconductor substrate is ground so that the semiconductor substrate has a desired thickness, the semiconductor substrate is then conveyed while controlling the temperature of the semiconductor substrate. The semiconductor substrate is then separated into a plurality of semiconductor elements. The occurrence of warping on the semiconductor substrate during conveyance of the semiconductor substrate is thus prevented.

Method of manufacturing semiconductor device using heated conveyance member

Growing community of inventors

Kawasaki, Japan

Keisuke Fukuda