Murata Manufacturing Co., Ltd.

Keisuke Araki

Yoshihito Otsubo

Hideki Kawamura

Jun Endo

Hiroyuki Wada

Nobuo Ikemoto

Jun Sasaki

Norio Sakai

Satoshi Ishino

Yuki Ito

Kosuke Nishio

Kohei Shimada

Kenji Kubota

Bunta Okamoto

Noriaki Okuda

Isamu Morita

Taku Mizuno

Hiroyuki Yoshioka

Rintaro Sugi

Masato Ishibashi

In a transmission line, a multilayer body includes a hollow portion above a signal conductor layer and below a ground conductor layer and overlapping the ground conductor layer when viewed in an up-down direction, and a spacer facing the hollow portion. In a cross section orthogonal to a front-back direction, an overlapping region is a region in the hollow portion in which the hollow portion overlaps the spacer in the up-down direction. In a cross section orthogonal to the front-back direction, a non-overlapping region is a region in the hollow portion in which the hollow portion does not overlap the spacer in the up-down direction. A length of the hollow portion in the up-down direction in the overlapping region is shorter than a length of the hollow portion in the up-down direction in the non-overlapping region.

Transmission line and electronic device

A multilayer resin substrate includes a stacked body, and a coil including a first coil conductor pattern and a second coil conductor pattern. The second coil conductor pattern includes a wide portion with a line width larger than a line width of the first coil conductor pattern. The wide portion includes overlapping portions that overlap with the first coil conductor pattern, and non-overlapping portions that do not overlap with the first coil conductor pattern, when viewed in a Z-axis direction. Adjacent non-overlapping portions in the Z-axis direction, when viewed in the Z-axis direction, protrude in opposite directions to each other in a radial direction, with respect to the first coil conductor pattern.

Multilayer resin substrate and method of manufacturing multilayer resin substrate

A dielectric ceramic that includes multiple crystal grains, each of the multiple crystal grains having an interface, a barium titanate (BaTiO)-based compound as a main component thereof, and a rare earth element. The dielectric ceramic has a cross-section in which the multiple crystal grains has a concentration varying region, a high concentration region, and a low concentration region. The concentration varying region has an RE/Ti ratio differing by 3% or more. The high concentration region has an RE/Ti ratio of 5% to 20%. The low concentration region has an RE/Ti ratio of 0% to 2%.

Dielectric ceramic and multilayer ceramic capacitor

A multilayer ceramic capacitor that includes a laminate having a plurality of dielectric layers and a plurality of internal electrodes that are alternately stacked, and external electrodes. Each of the dielectric layers contains first crystal grains and second crystal grains that each contain Ba, Ti, and a rare-earth element. A first mole ratio M1 of the rare-earth element to the Ti in a range from an interface to 50 nm inclusive of the first crystal grains and a second mole ratio M2 of the rare-earth element to the Ti in a range of 50 nm to 100 nm inclusive from the interface satisfy 0.95&#x2264;M1/M2&#x2264;1.05. A third mole ratio M3 of the rare-earth element to the Ti in the second crystal grains is half or less of a fourth mole ratio M4 of the rare-earth element to the Ti in the first crystal grains.

Multilayer ceramic capacitor

An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.

Electrical element, mobile device, and method for manufacturing electrical element

A pressing force sensor that includes a sensor element configured with a piezoelectric film, a lead terminal for connection to an external circuit, a wiring conductor which connects pressing force detection electrodes and the lead terminal, and a flexible printed circuit board which withstands solder reflow temperatures. The flexible printed circuit board has the pressing force detection electrodes formed on a first principal surface thereof, and is folded via a folding line while the first principal surface faces inward. The sensor element is deflected by a pressing force applied to a second principal surface which faces outward and is in a first area of the flexible printed circuit board which is on one side with respect to the folding line, and a signal corresponding to the pressing force is thus taken out from the pressing force detection electrodes.

Pressing force sensor

A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.

Resin substrate combined structure

Provided is a laminated ceramic capacitor which can suppress degradation of the insulation resistance due to the addition of vanadium. Second insulating layers are stacked on both sides in the stacking direction of a first insulating layer group, which has first insulating layers stacked over one another, and internal electrodes are placed on principal surfaces of the first insulating layers. At least one internal electrode is placed between the first and second insulating layers. Both contain, as their main constituent, a perovskite-type compound represented by the formula 'ABO' wherein 'A' denotes at least one of Ba, Sr, and Ca, &#x201c;B&#x201d; denotes at least one of Ti, Zr, and Hf. V is added to only the first insulating layers.

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Nagaokakyo, Japan

Keisuke Araki