Hitachi Chemical Dupont Microsystems, Ltd.

Keishi Ono

Tetsuya Enomoto

Keiko Suzuki

Masayuki Ohe

Kazuya Soejima

Etsuharu Suzuki

Tomonori Minegishi

Masayuki Ooe

Taku Konno

Masashi Kotani

A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula Ris a tetravalent organic group, Ris a divalent organic group and Rand Rare independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. Ris an alkyl group having 1 to 4 carbon atoms, Ris independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and Ris a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), Ris an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and Ris an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and Rand Rmay independently have a substituent. 

Polymide precursor resin composition

A polyimide precursor including a structural unit represented by the following general formula (1) in a ratio of 50 mol % or more based on the total structural units. In the general formula (1), A is a tetravalent organic group represented by the following general formula (2a), a tetravalent organic group represented by the following general formula (2b), or a tetravalent organic group represented by the following general formula (2c), and B is a divalent organic group represented by the following general formula (3). 

Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition

A positive photosensitive resin composition including:

Positive photosensitive resin composition, method for producing patterned cured film and electronic component

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Ibaraki, Japan

Keishi Ono