Mitsubishi Electric Corporation

Keiko Shirafuji

Makoto Kimura

Katsumi Miyawaki

Kiyoshi Ishida

Yukinobu Tarui

A semiconductor device includes a substrate, a semiconductor element, a ground pad, an insulating coating member, a conductive bonding member, and a conductive cap. The inner peripheral end of a bottom of the conductive cap is disposed at a side close to the inner periphery of the insulating coating member relative to the outer peripheral end of the insulating coating member. The bottom has a shape in which the distance between the main surface and itself decreases continuously from its outer peripheral end toward its inner peripheral end.

Growing community of inventors

Tokyo, Japan

Keiko Shirafuji