Fujitsu Corporation

Keiko Ohsawa

Terunobu Maruyama

Tadashi Konno

A cell arrangement evaluating method for predicting a wiring density based on only a cell arranging result prior to initiation of any wiring programs so as to easily perform wiring condition evaluation based on the wiring density within a short time. Two cells to be connected by wiring are selected, and a rectangular region is obtained in which the pins of the two cells to be connected are diagonal verfexes. The probability of wiring between the pins to be connected passing through a certain grid point of wiring grid is calculated. A proportion of the rectangular region occupying each evaluation unit grid is calculated, and then, for each evaluation unit grid, an index for an increase of a wiring density made by the factor of the wiring in the evaluation unit grid is calculated. Then, for each evaluation unit grid, the sum of indexes calculated for all the wiring lines among the cells as a wiring density in the evaluation unit grid is calculated. The cell arrangement evaluation method is used for designing an integrated circuit such an LSI or a circuit on a printed circuit board.

Cell arrangement evaluating method, storage medium storing cell arrangement evaluating program, cell arranging apparatus and method, and storage medium storing cell arranging program

A circuit element placement method and apparatus in which circuit elements can surely be placed in a short time even if a circuit scale is increased. For this purpose, there is sequentially executed a first step of determining placement coordinates of sequential logic circuit elements among many circuit elements to be placed and a second step of determining placement coordinates of circuit elements other than the sequential logic circuit elements with consideration given to the placement coordinates of the sequential logic circuit elements, determined in the first step. The method and apparatus are applicable at a time of design of an integrated circuit such as LSI, or a circuit on a printed wiring board.

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Kawasaki, Japan

Keiko Ohsawa