Kimoto Co, Ltd.

Resonac Corporation

Kanto Gakuin University Surface Engineering Research Institute

Japan Surface Treatment Institute Co., Ltd.

Keiko Kitamura

Mitsuhiro Watanabe

Tetsuji Ohta

Hideki Etori

Nobuhito Komuro

Yoshiaki Fuse

A photosensitive film of the present invention includes a carrier film having a first surface whose surface roughness is 0.1 to 0.4 μm, and a photosensitive layer formed on the first surface, in which a haze of the carrier film is 30 to 65%, and a spectral haze at a wavelength of 405 nm of the carrier film, as measured by providing a transparent resin layer in which a difference between a refractive index of the transparent resin layer and a refractive index of the photosensitive layer is within ±0.02 on the first surface, is 0.1 to 9.0%.

Photosensitive film and method for forming permanent mask resist

A material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. The material includes a non-conductive base material and a catalyst adhering layer, provided on the non-conductive base and including a water-insoluble polyester resin The catalyst adhering layer shows a contact angle of 60&#xb0; or smaller to purified water.

Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method

A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps.

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Saitama, Japan

Keiko Kitamura