Matsushita Electric Works, Ltd.

Keiko Kashihara

Kenji Ogasawara

Yoshihisa Sugawa

Hiroshi Yamamoto

Eiichiro Saito

Kiyotaka Komori

Masahiro Matsumura

Akiyoshi Nozue

Yasuo Tohrin

Shingo Yoshioka

Tatsuo Yonemoto

Shigehiro Okada

Ken-ichi Shinotani

Kohei Kotera

Joji Sakakibara

Tomoaki Iwami

Yoshinobu Marumoto

Flame retardant resin composition

Process of impregnating a layer substrate having openings which is substantially defined by opposing two main surfaces with a resin composition in the form of liquid, and the process is characterized in that one of the main surfaces and the resin composition are kept in such a contact condition that the substrate is located on the resin composition. A prepreg and a laminate are also provided which are produced by the use of the substrate which has been prepared by the above process.

Process of impregnating substrate and impregnated substrate

A polyimide composition is prepared with a polyimide containing minute hollow spherules made of a glass of a hydroxyl group content and having less than 0.5 mg/m.sup.2. A multilayer substrate for printed-wiring is prepared with this polyimide composition. The substrate possesses a low dielectric constant, dielectric dissipation factor and thermal expansion coefficient.

Polyimide composition and prepreg and laminate thereof

An addition type imide resin prepolymer is obtained by a reaction of unsaturated bisimide of 1.0 mol to diamine of 0.25 to 0.43 mol and an addition of polyamine having three or more benzene rings. The prepolymer is thereby made to contain substantially no unreacted diamine component which affects human body of operators, and to have remarkably excellent heat resistance and adhesive properties, while effective to restrain a production of any component of a molecular weight exceeding 15,000.

Addition type imide resin prepolymer, manufacturing method thereof,

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Ibaraki, Japan

Keiko Kashihara