Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Keiko Kashihara

Hiroharu Inoue

Shingo Yoshioka

Takashi Hoshi

Hiroaki Fujiwara

Tsuyoshi Takeda

Hiromitsu Takashita

Rihoko Watanabe

Tomohiro Fukao

Yuki Kitai

Tomoaki Sawada

Hirosuke Saito

Tatsuya Arisawa

Kyosuke Michigami

Takeshi Kitamura

Hidetaka Kakiuchi

Daisuke Yokoyama

Mao Yamaguchi

Chihiro Horii

Takashi Sagara

Lin Lin

Syunji Araki

An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (μm), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (μm), and a thickness is t (μm), the Rz1, the Rz2, and the thickness t (μm) satisfy relation of the following Formula (1): (Rz1+Rz2)/t≤0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 μm or more and 5.0 μm or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.

Elastic resin sheet having light-diffusing portion, and light-emitting sheet using same preliminary class

Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.

Prepreg, metal-clad laminate and printed wiring board

A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9&#x2264;X/X&#x2264;1.0 (I), where Xis a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and Xis a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.

Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board

A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2). 

Prepreg, metal-clad laminated board, and printed wiring board

A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.

Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material

A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: 

Prepreg, metal-clad laminated plate and printed wiring board

The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step.

Manufacturing method of molded article

An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25&#xb0; C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70&#xb0; C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board

One aspect of the present invention resides in a manufacturing method for a semiconductor package, including a covering step of forming a covering insulating layer that covers the surface of a semiconductor element, a film-forming step of forming a resin film on the surface of the covering insulating layer, a circuit pattern-forming step of forming a circuit pattern portion including recesses reaching the surfaces of electrodes of the semiconductor element and a circuit groove having a desired shape and a desired depth, a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on the surface of the circuit pattern portion, a film-separating step of separating the resin film from the covering insulating layer, and a plating processing step of forming a circuit electrically connected to the electrodes, by applying electroless plating to the covering insulating layer, from which the resin film is separated.

Growing community of inventors

Osaka, Japan

Keiko Kashihara