Sony Corporation

Keiki Fukuda

Mayumi Kamiya

Masaki Mikamo

Kenji Yoshida

Takeshi Harada

Takashi Nunomaki

Hisashi Ohashi

Isao Sasaki

Emi Arakawa

Kenji Tsushio

Riuzou Nagatsuka

Tetsuya Asai

Yoshihiko Nishimura

Katsuhiro Sugiyama

Sumio Hokari

An image pickup element package according to an embodiment of the present technology includes a solid-state image pickup element, a circuit board, a translucent substrate, and a support. The solid-state image pickup element includes a light-receiving surface, and a back surface on a side opposite to the light-receiving surface. The circuit board supports the back surface of the solid-state image pickup element. The translucent substrate is opposed to the light-receiving surface. The support includes a resin frame portion and a conductor portion and is disposed between the circuit board and the translucent substrate. The resin frame portion includes a hollow portion that houses the solid-state image pickup element, and a fixation portion that is fixed to a casing portion of an image-pickup device. The conductor portion is integrally provided in the resin frame portion and provides thermal connection between the circuit board and the fixation portion.

Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus

The present disclosure relates to a solid-state imaging device package that enables capturing of higher-quality images, a method of manufacturing the solid-state imaging device package, and an electronic apparatus. The solid-state imaging device package includes: a solid-state imaging device chip that converts light taken in by a lens into an electrical signal; an interposer substrate that secures the solid-state imaging device chip; a frame having a frame structure that encloses the solid-state imaging device chip and prevents emission of unnecessary light onto the light receiving surface of the solid-state imaging device chip; and a protective glass that protects at least the solid-state imaging device chip from external environments, and transmits light. A raised bank structure is formed on the adhesion surface of the frame in contact with the protective glass, and is formed along the entire circumference of the opening portion of the frame. The present technology can be applied to a solid-state imaging device package that encloses an imaging device chip, for example.

Solid-state imaging device package and manufacturing method, and electronic apparatus

The present invention is to provide an imaging apparatus superior in operability and visibility at the time of setting and adjusting functions thereof. The apparatus includes GUI screen image generating means for generating a GUI screen image for operating the imaging apparatus to display the GUI screen image on image display means; operating means for operating the GUI screen image displayed on the image display means; controlling means for controlling the imaging apparatus in accordance with the operation of the GUI screen image by the operating means; storing means for storing hierarchy type main menu information; menu generating means; and menu editing means capable of editing the unique menu information generated by the menu generating means. The controlling means controls the GUI screen image generating means when detecting a predetermined operation by the operating means, and the GUI screen image generating means generates the GUI screen image in which the index information to operate the menu editing means is included in the unique menu information, in accordance with the control by the controlling means, and displays the GUI screen image on the image display means.

Imaging apparatus

An imaging apparatus generates a GUI screen image for operating the imaging apparatus. A controller controls the generation of the GUI screen image upon detecting a predetermined operation.

A solid-state imaging device includes: a photoelectric conversion device; a wire grid polarizer provided on the photoelectric conversion device; and a conductive film electrically connecting conductive layers provided in the photoelectric conversion device to the wire grid polarizer.

Solid-state imaging device, manufacturing method of solid-state imaging device and electronic apparatus

Imaging device

An imaging apparatus having an imaging means for imaging an object is provided, when connected to an external device, the apparatus is capable of setting on a screen a function corresponding to the external device, and also capable of displaying a character or outputting sound, corresponding to an automatic power-off function or the switched over operation mode. An imaging apparatus includes imaging means for imaging an object, recording and playback means for recording and playing back image data imaged by the imaging means, and connection means for connecting an external device having a connection format which conforms to a predetermined standard, wherein the connection means selects or sets a format of the connection to the external device by changing-over of a switch

Growing community of inventors

Tokyo, Japan

Keiki Fukuda