Hitachi, Ltd.

Keiji Ueyama

Seiichi Watanabe

Saburo Kanai

Ryooji Fukuyama

Yutaka Kakehi

Makoto Nawata

Masahiro Mase

Takashi Nagaoka

Kimio Muramatsu

Akira Nishiuchi

Ichiro Gyobu

Yoshihisa Awada

This invention relates to a microwave plasma processing method and apparatus. An electromagnetic field intensity distribution of a microwave, which is incident into a plasma generation chamber and is again incident due to irregular reflection, is made uniform by uniforming means fixed inside a waveguide, a processing gas is converted to plasma by use of the microwave having the uniformed electromagnetic field intensity distribution, and a sample is plasma-processed by the resulting plasma. Accordingly, the electro-magnetic field of the microwave, which is incident, and is again incident, into the plasma generation region and locally increases a plasma density, is absorbed, attenuated or diffused by the uniforming means so that the distribution of the plasma density is made uniform and uniform processing can be effected.

Microwave plasma processing method and apparatus

A vacuum pump with a heating portion for preventing adhesion of reaction products on a discharge side thereof.

Vacuum pump

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Goshogawara, Japan

Keiji Ueyama