Alps Electric Co., Ltd.

Keiji Takagi

Osamu Sakai

Hideaki Nagakubo

Kazutoshi Watanabe

Naoki Yamada

Koichi Yamamoto

Katsuyuki Katayama

Shinichiro Kimura

Takenobu Kimura

Naoya Akiyama

Masahiro Ishida

Toshinobu Hosaka

Naomi Sato

An input device includes a plurality of manipulation portions; an input function portion manipulated by the manipulation portions to perform an input function; a light guiding sheet facing the rear side of the plurality of manipulation portions; and a light source applying light into the light guiding sheet, wherein a rear surface opposite to a front surface of the light guiding sheet facing the manipulation portions is provided with a plurality of concave portions which is depressed to the inside of the light guiding sheet, wherein each concave portion has a circular opening and an inner surface which is a smooth concave curve surface, and wherein light propagated through the inside of the light guiding sheet is reflected by the inner surface toward the inside of the light guiding sheet, and the light is applied from the front surface of the light guiding sheet to the manipulation portions.

Input device and keyboard device having illumination function

Paste comprising metallic organic compound, in particular, gold-based metallic organic compound is used as a conductive material for repairing open defects in a metal pattern. After applying the paste, the paste is baked to deposit a metal film. This can produce a very thin metallic film having low electric resistance. Further, a semiconductor laser is used as a heating unit to heat only the paste applied to the open defect. A heating profile having a multi-step baking process includes a provisional baking and main baking process followed by a cooling process to produce a high-quality thin metallic film having no cracks and a dense texture.

Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate

Paste comprising metallic organic compound, in particular, gold-based metallic organic compound is used as a conductive material for repairing the broken defective part and is baked. This can produce a very thin metallic film having low electric resistance. Further, a semiconductor laser is used as a heating unit to heat only the broken defective part, and a heating profile having a baking process of provisional baking and main baking and a cooling process is provided to produce the high-quality thin metallic film having no crack and a dense texture.

Growing community of inventors

Fukushima-ken, Japan

Keiji Takagi