Denso Corporation

Keiji Shinyama

Shoji Miura

Ichiharu Kondo

Tomoya Uchida

[Problem] To provide a plating method and apparatus which do not require preparation of a separate treatment tank for each treatment step and therefore enable the facility to be reduced in size and, further, which can reduce the amounts of use of the treatment solutions. [Solution] A plating apparatus feeding a plating solution to a treatment tank in which an electrode is arranged and plating a workpiece made of a metal so as to perform plating, the plating apparatus characterized by being provided with a plurality of pipes which are connected to an outer wall of the treatment tank and a switch valve which is provided able to rotate at an inner side of the outer wall and which has at least one feed port for making at least one treatment solution feed pipe selected from the plurality of treatment solution feed pipes communicate with the treatment tank.

Plating apparatus and plating method

A semiconductor device includes a semiconductor substrate; an aluminum electrode disposed on the substrate; a protection film disposed on the aluminum electrode; an opening disposed on the protection film for exposing the aluminum electrode; and a metal electrode disposed on a surface of the aluminum electrode through the opening. The aluminum electrode includes a concavity disposed under the opening. The aluminum electrode disposed at the concavity has a thickness equal to or larger than a depth of the concavity. The surface of the aluminum electrode includes multiple concavities and multiple convexities.

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Kariya, Japan

Keiji Shinyama