Sony Corporation

Keiji Sasano

Hiroaki Tanaka

Tsuyoshi Watanabe

Hiroki Hagiwara

Kenzo Tanaka

Noboru Kawabata

Hirokazu Yoshida

Koji Tsuchiya

Hironori Yokoyama

Takaya Wada

Yuki Tuji

Yuki Tsuji

A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Solid-state image sensing apparatus and electronic apparatus to improve quality of an image

A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

Solid-state imaging device and electronic apparatus

Solid-state image sensing apparatus and electronic apparatus to improve image quality of an image

Solid-state image sensing apparatus and electronic apparatus

A hollow package includes a package body composed of an epoxy resin having a low thermal coefficient of linear expansion, wherein the package body includes a recess for receiving an electronic component, and leads, for extracting electrodes of the electronic component, extending from the inner surface of the recess, via the upper surface of the package body, to the peripheral surface, and a transparent sealing plate bonded onto the upper surface of the package body with an ultraviolet-curable resin.

Method for fabricating hollow package with a solid-state image device

Hollow package and method for fabricating the same and solid-state image apparatus provided therewith

Growing community of inventors

Tokyo, Japan

Keiji Sasano