Fujikoki Corporation

Other

Research Development Corporation of Japan

Fuji Koki Manufacturing Co., Ltd.

Mitsubishi Denki Kabushiki Kaisha

Fujikoki Mfg. Co., Ltd.

Honshu Paper Co., Ltd.

Jewel Power Co., Ltd

Fuji Koji Manufacturing Co., Ltd.

Keiji Sasaki

Hiroaki Misawa

Noboru Kitamura

Akira Sawada

Hazime Tanaka

Hiroshi Masuhara

Junichi Miyano

Hirayoshi Suzuki

Isao Okura

Hitoshi Nagase

Masanori Koshioka

Kazuhiko Watanabe

Yasushi Yamanaka

Teruyuki Hotta

Shigeki Ito

Koichi Otani

Takanobu Takeuchi

Ryo Matsuda

Motomi Ichihashi

Katsumi Moronuki

Ryo Fujisawa

Nobura Kitamura

Kenji Kamada

Masayuki Koguchi

Yukio Koganei

Hirayosho Suzuki

Jun-ichi Miyano

A pressure sensor comprises a housing having a pressure introduction hole, a pressure detecting element formed of a semiconductor device having the piezoelectric resistance effect, a holder for fixing the pressure detecting element, and a connector case. The pressure detecting element and the holder are airtightly joined to form a pressure sensor body in which an interior space is defined. A circuit board having an electrode pad is provided on the holder of the pressure sensor body, and a connector in the connector case and the electrode pad are connected by means of an electrically conductive spring body having elasticity. The holder is supported in the housing by means of a guide frame and an O-ring.

Pressure sensor

A pressure sensor comprising a holderhaving mounted thereto a semiconductor pressure sensor elementthat outputs a voltage signal corresponding to the pressure it receives, a connector casefor fixing a lead memberconnected to the semiconductor pressure sensor element, a diaphragmthat defines together with the holdera pressure sensing chamberfilled with insulating oil, and a lid membermade of metal to which a pressure introduction pipeis mounted, wherein the holderis made of metal and has a through-holethat communicates the pressure sensing chamberwith the exterior and a seal memberthat seals the through-hole, the connector casehas an insert holecommunicated with the through-holeand through which the seal memberis inserted, and the diaphragmis sandwiched between the holdermade of metal and the lid membermade of metal and bonded thereto.

A pressure sensor comprising a housing having a pressure introduction hole a pressure sensing element composed of a semiconductor element having piezoresistance effect, a holder having fixed thereto the pressure sensing element a guide member a seal member and a connector case the pressure sensor element and holder joined in airtight manner to create a reference pressure chamber On the holder of the pressure sensor body is mounted a circuit board having electrode pads, the electrode pads connected to connectors fixed to the connector case via conductive spring bodies The guide member supports holder and in the opening of the guide member is placed the seal member

Pressure sensor with electrically conductive spring bodies for connecting and fixing connector case and pads

An expansion valve unit having a pressure detecting function includes a supercooling control expansion valve disposed in a flow path of a refrigerant sent into an evaporator of a refrigeration system constituting a refrigerating cycle to control the flow rate of the refrigerant. A pressure detector is provided at one end of the supercooling control expansion valve to detect the pressure of the refrigerant sent thereto through a passage in the expansion valve. The supercooling control expansion valve and the pressure detector are integrated with each other by a joining means.

Expansion valve unit having pressure detecting function

A pressure sensor comprises a housing having a pressure introduction hole , a sensor element having semiconductor elements with piezoresist effects, a holder for fixing the sensor element , and a pressure case having electromagnetic shield effect. The sensor element , holder and pressure case are welded airtightly so as to form a pressure sensor body formed with a reference pressure space. The pressure sensor body is retained in an electrically insulated manner in the housing

Noise reduced pressure sensor

A manufacturing method for rayon having ion-generating characteristics, featuring a ceramic content comprising 10-40% tourmaline by weight, 10-40% serpentine by weight, and 40-80% silica by weight. The ceramics are subjected to dry pulverization processing to achieve particle diameters of 2-10 &mgr;m, and then to wet pulverization processing to make ceramic fine particle powder with average particle diameters under 0.5 &mgr;m. The ceramic fine particle powder is then mixed as ceramic solids in viscose so that the ceramic content by weight is 15-35% that of cellulose. The viscose is mixed by quantitatively and continuously adding the above dispersion of ceramic in water with a vacuum-sealed agitator device installed in the viscose pipe circuit just prior to spinning of the viscose.

Rayon fiber with ion-generating, characteristics and a method for manufacturing it

The object of the present invention is to provide a pressure sensor comprising a pressure sensing element of a plurality of resistors on a semiconductor board, wherein said pressure sensing element is fixed inside the housing firmly and airtightly. A pressure sensor,comprising a housing,made of metal material, and a pressure sensing element mounted on a semiconductor board,positioned in the interior of said housing for sensing pressure, wherein said housing,comprises a liquid induction hole,, an inner area connecting to said liquid induction hole and having an opening in an upper portion, and an annular protrusion 11,formed in the peripheral of an opening of said liquid induction hole at a bottom portion of said inner area, characterized in that said pressure sensing element,is welded airtightly to said protrusion,of said housing,through a seat,comprising an opening,at the center thereof formed of a pressure sensing element mounting member,-,and a stem connecting member,, and a stem,having an opening,at the center thereof.

Semiconductor pressure sensor for sensing fluid pressure

A pressure sensor,comprises a metallic housing,having a space,communicated to a pressure detection space and a thin rising portion,formed on the upper end of the peripheral area, a sensor element,, a sensor element holder,, a metallic pressure case,having a ceiling portion,, and a connector case,formed of an insulating material, wherein a collar portion,of a base plate,of the sensor element,including a pressure sensing element,is contacted to an annular protrusion,positioned around the opening,of the sensor element holder,, and the collar portion,is airtightly welded to the annular protrusion,by projection welding. Further, the collar portion,on the pressure case,and the peak surface,of the holder,is airtightly welded by an electron beam welding. The airtight interior space defined by the sensor element,, the sensor element holder,and the pressure case,is utilized as the reference pressure space.

The present pressure sensor is formed to enable an easy assembly of the sensor body, the sensor element, the substrate, the lead, the shield plate, the terminal holder, the terminal, the water-proof o-ring, the connector case, and further enabling an easy change in design of the connector case. In a pressure sensor comprising a housing 1 and a connector case 9, and having in the interior thereof a sensor element 2, a substrate 3, a lead 4, a shield plate 5, a terminal holder 71, a terminal 72, water-proof o-rings 8a and 8b, a joint 6 is equipped having a staking portion against the housing 1 and the connector case 9 on its upper portion and its lower portion. This could be formed as a joint having a shield portion formed as one unit.

Pressure sensor including a joint for connecting a housing and connector

A semiconductor pressure detecting device comprises a package having a pressure introducing hole; a base plate which has a first through hole and is mounted in the package; a base mounted on the base plate; and a semiconductor pressure sensor chip which is mounted on the base; wherein the base plate has a thickened portion formed around the first through hole and is fixed by welding the circumference of the thickened portion onto the package.

Semiconductor pressure detecting device

A pressure sensor prevents the occurrence of a large deformation or breakage of the diaphragm in a strain gage-type pressure sensor utilizing a thin plate-shaped insulating body as the diaphragm. The pressure sensor comprises an insulating diaphragm having a strain gage on its surface and a substrate positioned opposing the surface of the diaphragm on which the strain gage is mounted and kept a predetermined distance away from the surface. The diaphragm can be formed of material such as ceramic of alumina, zirconia or the like, silicon or crystal. The substrate can be formed of either the same material as the diaphragm, or the surface opposing the diaphragm can be formed of an insulator disposed on metal. The diaphragm and the substrate can be affixed using a low-melting glass.

Strain gage pressure sensor wherein a gap is maintained between the

A pressure-sensitive switch typically used in an automobile engine room comprises: a housing having a passage communicating with a pressurized fluid path; a switch case fixed to the housing; a diaphragm contained in an interior space defined by the housing and the switch case; a snap disk 31 responsive to an applied pressure to change its shape between two aspects by a snapping motion; a receiving member 50 that receives the snap disk, and switch elements closed or opened by the snapping motion of the snap disk. The receiving member 50 is made of polyphenylene sulfide (PPS) resin.

Pressure-sensitive switch with polyphenylene sulfide resin receiving

A pressure sensor comprises a pressure-sensitive coupler body 2 having one end provided with a diaphragm 8 and strain gage 9 stacked together, an intermediate body 3 containing a printed board 21 and encircling the strain gate 9, and a signal-detective coupler body 4 opposed to the pressure-sensitive coupler body 2 via the intermediate body 3 to define a closed chamber in the intermediate body 3. The printed board 21 and the strain gage 9 are electrically connected by terminal elements 13 extended from the strain gage 9 into slidable contact with conductive elements 25 attached to an edge of the printed board 21. Vibrations or impulses produced in the diaphragm 8 are therefore absorbed by a relative displacement between the terminal elements 13 and the conductive elements 25 to protect the printed board 21 against such vibrations or impulses.

Pressure sensor including a pair of slidable contacts between a strain

A method of spectrometry is disclosed for measuring transient absorbance and transient absorption spectrum of a substance to be measured at interfaces in liquid phase of particulates containing a fluorescent pigment and the substance to be measured by the utilization of optical resonance phenomenon. An apparatus for carrying out the method is also disclosed and comprises: (a) a pulse laser oscillator for exciting the fluorescent pigment and the substance to be measured, respectively; (b) an optical delay device for causing delay of any one of pulse laser beams of two kinds of wavelengths generated by the pulse laser oscillator; (c) a microscope system for condensing laser beams generated by the pulse laser oscillator and irradiating the condensed beams to the sample; and (d) a detector for detecting light emission of the sample. According to the method of the present invention, it is possible to measure transient absorbance and transient absorption spectrum at a high sensitivity even when particulates containing the substance to be measured in liquid phase are present.

Method and apparatus for spectrometric measurement of particulate

The present invention provides microprocessing and the device therefor which is characterized by radiating proessing pulse laser together with trapping laser to perform the modification and processing of particles and micropcapsules. In the case of using such method for implosion, the reaction group is caused to be released by imploding the micro capsule with the reactive goup enclosed to implosion, permitting specified reaction and processing.

Growing community of inventors

Tokyo, Japan

Keiji Sasaki