Nissan Motor Company Limited

Sumitomo Eaton Nova Corporation

Sen Corporation, an Shi and Axcelis Company

Chisso Corporation

Sumitomo Heavy Industries Ion Technology Co., Ltd.

Keiji Okada

Hirofumi Tsuchida

Akira Tayama

Fumiaki Sato

Suguru Hirokawa

Mitsukuni Tsukihara

Michiro Sugitani

Junichi Murakami

Masamitsu Shinozuka

Yoshitomo Hidaka

Kazuhiko Kanetoshi

Keisuke Yamamoto

Kenji Furukawa

Manabu Uchida

Atsushi Miyazawa

Yasuhiro Numao

Takaharu Nakano

Motoki Yaginuma

Keiji Ichihara

Tetsuya Kudo

Tsutomu Yamazaki

Tadamoto Tamai

Toshikazu Shiino

Tomokatsu Himeno

Guofang Wang

Kentarou Yajima

Kouji Ishihara

Yoshito Fujii

Shinji Ebisu

Katsuhiro Taniguchi

Toshihiko Tsuda

Hiroaki Nakaoka

Masatoshi Kozaki

Tarou Yokoi

A fuel cell includes a fuel cell stack, a casing, an application part, and a facilitating mechanism. The facilitating mechanism has a space that is provided between the casing and an upper current collector. The upper current collector and the casing are connected at inclined surfaces.

Solid oxide fuel cell

A fuel cell system including: a solid oxide type fuel cell that is supplied with an anode gas and a cathode gas to generate an electric power; a fuel tank that stores a water-containing fuel containing water; a fuel supply passage that couples the fuel cell to the fuel tank; a reformer disposed on the fuel supply passage, the reformer reforming the water-containing fuel into the anode gas; a separator disposed on the fuel supply passage in an upstream side with respect to the reformer, the separator separating the water contained in the water-containing fuel; a detector disposed in the upstream side with respect to the reformer, the detector detecting or estimating a moisture content contained in the water-containing fuel; and a control unit that controls the separator. The control unit controls the separator on the basis of the moisture content detected or estimated by the detector.

Fuel cell system and control method for controlling moisture content of fuel

Provided is an ion implantation apparatus including: a vacuum processing chamber in which an ion implantation process for a wafer is performed; one or more load lock chambers that are used for bringing the wafer into the vacuum processing chamber and taking out the wafer from the vacuum processing chamber; an intermediate conveyance chamber that is disposed to be adjacent to both the vacuum processing chamber and the load lock chamber; a load lock chamber-intermediate conveyance chamber communication mechanism including a gate valve capable of sealing a load lock chamber-intermediate conveyance chamber communication port; and an intermediate conveyance chamber-vacuum processing chamber communication mechanism including a movable shielding plate capable of shielding a part or the whole of the intermediate conveyance chamber-vacuum processing chamber communication port.

Ion implantation apparatus and control method for ion implantation apparatus

An electrical conductive member includes: an electrical conductive structure including: a substrate; an electrical conductive carbon layer provided on at least one surface of the substrate and containing electrical conductive carbon; and a middle layer interposed between the substrate and the electrical conductive carbon layer. An intensity ratio R (I/I) of a D-band peak intensity (I) to a G-band peak intensity (I) measured by a Raman scattering spectroscopic analysis in the electrical conductive carbon layer is between 1.4 and 1.9.

Electrical conductive member and polymer electrolyte fuel cell using the same

Two load lock chambers having a load lock pedestal are provided adjacent to a vacuum process chamber through a vacuum intermediate chamber. A passage opening is provided between the vacuum process chamber and the vacuum intermediate chamber. Two wafer retaining arms are installed between a platen device in the vacuum process chamber and the vacuum intermediate chamber. The two wafer retaining arms are reciprocatingly movable between the corresponding load lock pedestals and the platen device while passing through the passage opening and crossing with an overpass each other at different levels. By retaining an unprocessed wafer by one of the wafer retaining arms and retaining a processed wafer by the other wafer retaining arm, transfer of the unprocessed wafer from one of the load lock pedestals to the platen device and transfer of the processed wafer from the platen device to the other load lock pedestal are performed simultaneously.

Wafer processing system, wafer processing method, and ion implantation system

Embodiments of the invention are directed to a method of controlling a mover device The method includes generating a moving force from a moving force generating unit to move a processing base with respect to a movable base, thereby moving the processing base with respect to a fixed base as a result of the movement of the processing base with respect to the movable base; moving the movable base on the fixed base in the opposite direction to the moving direction of the processing base by virtue of a reaction force caused by the moving force generated from the moving force generating unit to move the processing base, so that the movable base moves in the opposite direction to the moving direction of the processing base on the fixed base. The method further includes controlling the moving velocity of the processing base with respect to the fixed base.

Method of controlling mover device

A mover device and an ion implanter apparatus having a processing base that reciprocates at a high speed without undesirable noise and vibration are provided. The mover device includes: a fixed base; a movable base that is linearly movable with respect to the fixed base; a processing base that is linearly movable with respect to the movable base; a main linear motor that generates a moving force to move the processing base with respect to the movable base, thereby moving the processing base with respect to the fixed base; and a velocity control unit that controls the moving velocity of the processing base with respect to the fixed base. In this mover device, the movable base is moved by virtue of a reaction force caused by the moving force to move the processing base.

Mover device and semiconductor manufacturing apparatus and method

A charge transporting material, a light emitting material and an organic electroluminescent device having high efficiency using a specified diazapentacene derivative represented by the following general formula (1):(in the general formula (1), Rto Reach represents independently a hydrogen atom, a halogen atom, an alkyl group of 1 to 6 carbon atoms, an alkoxy group, a substituted or not-substituted amino group, an aryl group or a heterocyclic group, in which the substituted or not-substituted aryl group or heterocyclic group, when they are adjacent with each other, may be of a structure condensed to each other, Xand Xeach represents independently an oxygen atom or a sulfur atom, and Yand Yeach represents independently a substituted or not-substituted alkyl group of 1 to 6 carbon atoms, an aryl group or a heterocyclic group).

Charge-transporting material containing diazapentacene derivative, luminescent material, and organic electroluminescent element employing these

An exhaust gas purification device including three-way catalysts connected to engine cylinder groups and arranged in parallel, and a NOx trapping catalyst connected with the three-way catalysts downstream thereof. A controller controls fuel injection for making an A/F ratio of exhaust gas flowing into one of the three-way catalysts rich relative to a stoichiometric A/F ratio when it is required to reduce the NOx trapped by the NOx trapping catalyst.

Exhaust gas purification device for an engine and A/F ratio control for early activating a NOx trapping catalyst

An exhaust gas purifying system for a cylinder direct internal combustion engine having a fuel injector valve for directly injecting fuel into a combustion chamber of the engine. The exhaust gas purifying system comprises an adsorbent catalytic converter disposed in an exhaust gas passageway of the engine. The adsorbent catalytic converter including a catalytic element having an adsorption layer. The adsorption layer contains an adsorbent for adsorbing HC (hydrocarbons) of exhaust gas in a first temperature range and to release the adsorbed HC in a second temperature range which is high relative to the first temperature range, and a catalyst component for promoting reaction for oxidizing HC which is released from the adsorbent. A control unit is provided to be programmed to carry out (a) judging that a temperature of the adsorption layer has reaches a releasing level relating to the second temperature range, so as to make a first judgment result; (b) judging that a temperature of exhaust gas flown into the adsorbent catalytic converter will rise upon injection of an additional fuel from the fuel injector valve into the combustion chamber during a time period including an expansion stroke and an exhaust stroke of the engine, so as to make a second judgment result; and (c) causing the fuel injector valve to controllably inject the additional fuel during the time period including the expansion stroke and the exhaust stroke of the engine upon making both the first and second judgment results.

Exhaust gas purifying system for internal combustion engine

A catalyst in an exhaust passage for an engine is capable of storing oxygen. A memory stores, as an oxygen storage capacity, an oxygen storage amount at the time of change of the downstream air-fuel ratio on the downstream side of the catalyst from stoichiometric to lean. A processor calculates the current oxygen storage amount accurately in due consideration of a fast oxygen absorbing rate in the case of the downstream air-fuel ratio being stoichiometric, and a slow oxygen absorbing rate in the case of the downstream air-fuel ratio being lean, and controls the air-fuel ratio of the exhaust gas mixture flowing into the catalyst so as to bring the oxygen storage amount in a region under the oxygen storage capacity.

Air-fuel ratio control for exhaust gas purification of engine

An exhaust emission control system for an internal combustion engine is provided. The exhaust emission control system comprises a catalytic converter disposed in an exhaust passage of the engine, a wide-range A/F ratio sensor disposed in the exhaust passage at a location downstream of the catalytic converter for detecting an A/F ratio of a mixture supplied to the engine, and a control unit including a detecting section for detecting the degree of water gas reaction caused in the catalytic converter and a correcting section for correcting a detected value of the A/F ratio on the basis of the degree of water gas reaction.

Exhaust emission control system for internal combustion engine

A wafer transport apparatus comprises a wafer loading shuttle unit 30 and a wafer unloading shuttle unit 40, positioned on both sides of vacuum cassettes 20 provided in batch processing ion implantation equipment. Each shuttle unit has shuttle cassettes 31, 41 having wafer supports corresponding to wafer holding racks. Each shuttle cassette is configured so that movement between a transfer position for transferring wafers to and from the cassette unit and a standby position is possible. The wafer holding racks support the wafers at a central area thereof. The wafer supports support the wafer on both sides along the diameter of the wafer at points away from the central area.

Wafer transport apparatus that can transfer multiple wafers in a short

In a robot arm for use in converting rotary motion of a rotatable axle located within a main post into linear motion of a chuck arm, a first arm unit is fixed to the rotatable axle while a first gear is fixed to the main post so that the first gear is rotated relative to the first arm unit with rotation of the rotatable axle. Rotation of the first arm unit is transmitted through a first power transmission element to a second gear which is rotatably supported on a first fixed axle. A second arm unit is fixed to the second gear while a third gear is fixed to the first fixed axle so that the third gear is rotated relative to the second arm unit. Relative rotation of the third gear is transmitted via a second power transmission element to a fourth gear fixed to the chuck arm. A first gear ratio of the first to the second gears and a second gear ratio of the third to the fourth gears are equal to 2:1 and 1:2, respectively, so that the rotary motion of the rotatable axle is converted into the linear motion of the chuck arm. In addition, a distance between the rotatable axis and the first fixed axle is equal to a distance between the firts and the second fixed axles. The main post is accommodated within a housing so that the main post is selectively moved downwards and upwards or is rotated.

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Kanagawa, Japan

Keiji Okada