Sony Semiconductor Solutions Corporation

Sony Corporation

Dai-ichi Kogaku Co., Ltd.

Sony Group Corporation

Keiji Ohshima

Nobutoshi Fujii

Minoru Ishida

Hiroshi Tazawa

Suguru Saito

Hiroyasu Matsugai

Hiroyuki Itou

Toshiaki Shiraiwa

Masanori Iwasaki

Toshihiko Hayashi

Shuzo Sato

Yusuke Moriya

Yoshiya Hagimoto

Takashi Oinoue

Toshihiro Kurobe

Koichi Takeuchi

Atsushi Yamamoto

Takahiro Saito

Koichiro Zaitsu

Shuji Manda

Naohiko Kimizuka

Munekatsu Fukuyama

Shinichi Miyake

Masaki Okamoto

Keiichi Nakazawa

Kazunori Nagahata

Hirofumi Yamashita

Junpei Yamamoto

Kunihiko Hikichi

Shigetaka Mori

Shinji Nakagawa

Hirotaka Yoshioka

Shintaro Okamoto

Yohei Hiura

Sotetsu Saito

Yasushi Hamamoto

Tomoki Kambe

Ryo Ogata

Tatsuki Miyaji

Yui Yuga

There is provided a solid-state imaging device including: a first semiconductor layer including a photoelectric converter and an electric charge accumulation section for each pixel, the electric charge accumulation section in which a signal electric charge generated in the photoelectric converter is accumulated; a pixel separation section that is provided in the first semiconductor layer, and partitions a plurality of the pixels from each other; a second semiconductor layer that is provided with a pixel transistor and is stacked on the first semiconductor layer, the pixel transistor that reads the signal electric charge of the electric charge accumulation section; and a first shared coupling section that is provided between the second semiconductor layer and the first semiconductor layer, and is provided to straddle the pixel separation section and is electrically coupled to a plurality of the electric charge accumulation sections.

Solid-state imaging device

There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.

AF module, camera module, and electronic apparatus

The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Stacked lens structure, method of manufacturing the same, and electronic apparatus

To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.

Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and method

A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.

Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrate

Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.

Lens substrate, semiconductor device, and electronic apparatus

Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked based on an alignment mark. The alignment mark is formed simultaneously with the through-hole. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. In particular, one or more air grooves formed in surfaces of the substrates reduces an influence of air inside a void portion between adjacent lenses of a layered lens structure.

Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic device

Stacked lens structure method of manufacturing the same, and electronic apparatus

An insulation film on a substrate is subjected to a plasma treatment using a gas containing at least either of a CH-based gas and a CO-based gas, whereby variations in the dielectric constant of the insulation film and adsorption of water onto the insulation film can be suppressed.

Plasma treatment method and method of manufacturing semiconductor device

Astronomical telescope

Growing community of inventors

Tokyo, Japan

Keiji Ohshima