Shin-Etsu Chemical Co., Ltd.

Semileds Corporation

Keiji Ohori

Nobuaki Matsumoto

Shuhei Ueda

Yoshinori Ogawa

Kohei Otake

Chen-Fu Chu

Kazunori Kondo

Toshiyuki Ozai

David Trung Doan

Taichi Kitagawa

Yi-Feng Shih

Shih-Kai Chan

Trung Tri Doan

Hideo Nakagawa

A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.

Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component

A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate

Growing community of inventors

Saitama, Japan

Keiji Ohori