Murata Manufacturing Co., Ltd.

Nec Corporation

Nippon Steel Corporation

Zaidan Hojin Biseibutsu Kagaku Kenkyu Kai

Nippon Steel Sumitomo Metal Corporation

Keiji Ogawa

Mitsuhide Kato

Tomio Takeuchi

Yoshiaki Nakazawa

Masa Hamada

Takaaki Aoyagi

Hiroshi Naganawa

Ryuichi Nishimura

Yasuhiko Muraoka

Makoto Tsuda

Machiko Nagai

Takashi Hasegawa

Kenichiro Otsuka

Hiromichi Kitajima

Katsuhiro Ikada

Yutaka Ishiura

Yoshikazu Chigodo

Tetsuya Saito

Hiroki Dejima

Tadamasa Ushiroku

Junya Shimakawa

Hideyuki Fujiki

Junki Natori

Yoshinori Yamada

Hiroshi Matsui

Yoshikazu Chigodou

A method for producing a press-formed product includes a first pressing step and a second pressing step. In the first pressing step, an intermediate formed product is formed from a processed material by using first press tooling. The intermediate formed product includes a stepped section of a top plate section, a temporary vertical wall section adjacent to the top plate section via a ridge section and having at least part of the shape of the vertical wall section, and a temporary flange section adjacent to the temporary vertical wall section via a temporary ridge section. In the second pressing step, the press-formed product is formed from the intermediate formed product. In the second pressing step, forming is performed such that the temporary ridge section is moved toward the temporary flange section with at least part of the top plate section of the intermediate formed product restricted.

Method for producing press-formed product

A press forming apparatus includes: a punch; a blank holder disposed adjacent to the punch; a die being a counterpart of the punch; and a pad disposed to face the punch. The punch has a tip surface, an outside surface, and a stepped surface having shapes corresponding to a web portion, vertical wall portions, and a flange portion of a product, respectively. When the punch and the die are relatively moved in a pressing direction in a state where a middle portion in a width direction of a workpiece is sandwiched by the pad and punch and an outer peripheral portion in the width direction of the workpiece is bound by the blank holder and the die, the workpiece's outer peripheral portion in the width direction gets out from between the blank holder and the die, and the flange portion is shaped by the die and the punch's stepped surface.

Press forming apparatus and press forming method

An electronic component module includes a module body including a substrate having components mounted thereon. A metal case is attached to the substrate to cover the components of the module body. The metal case includes a top-plate portion arranged substantially parallel to the main surface of the substrate and claw portions arranged at both edges thereof. The claw portions each include a claw body defined by a rectangular portion that is bent at an edge of the top-plate portion and extends in the direction of the substrate and a holding claw. In addition, contacting portions are bent at both ends of the rectangular portion to extend towards the inner portion of the main surface of the substrate. The contacting portions come into contact with the main surface of the substrate, and the holding claws are soldered to the side surfaces of the substrate. Accordingly, it is possible to provide an electronic component module in which the proportion of a mounting area, in which components can be mounted, to a main surface of a substrate is increased, and in which positioning of a metal case can be easily performed.

Electronic component module

A laminated electronic component includes a laminated block in which a plurality of electrically insulating layers are laminated. An external conductor film is disposed on a surface of the laminated block. An additional conductor film which is at the same potential as the external conductor film is arranged such that it faces the external conductor film with an insulating layer disposed therebetween. The additional conductor film and the external conductor film are electrically connected to each other through a via-hole conductor so that they are at the same potential.

Laminated electronic component

A laminated electronic component includes a laminate having first and second major surfaces. Four predetermined indication locations are provided on the first major surface. One or more via-hole conductors are arranged at corresponding one or more of the indication locations. The locations and the number of indicating via-hole conductors allows for identification of information regarding the laminated electronic component. Each indicating via-hole conductor is exposed at the first major surface, does not reach the second major surface, and is electrically isolated from wiring conductors built into the laminate.

An integrated electronic component includes a ceramic substrate incorporating circuit elements and/or having circuit elements mounted thereon, and a metal case mounted on the ceramic substrate. Notches are formed in substrate-facing segments of the metal case at the positions opposing the corners of the top surface of the ceramic substrate. The notches have a tapered shape having obtuse angles with respect to the top surface of the substrate. The notches may have a substantially circular arc shape. The substrate-facing segments having the notches are seamlessly connected to side segments of the metal case, bent in the vicinity of the notches, and supported by the bent portions in a cantilevered fashion.

Integrated electronic component

An antennaequipped on a mobile communication deviceincludes a helical antennaprotruding from a casing(key side casing portion) of the mobile communication deviceand a capcovering a surface of the helical antennaand is constructed such that degradation of antenna gain of the helical antennadue to contact of a fingerwith the helical antenna is prevented by increasing a distance between an outer peripheral surface of the capand a surface of the helical antennato at least 1.00 mm by increasing a wall thickness of the cap

Antenna structure of mobile communication device and mobile communication device having the same antenna structure

A non-reciprocal circuit element which can be miniaturized while still providing a matching capacitance having a large value. A circulator, for example, has central electrodes and a multilayer substrate for forming a matching capacitance. The multilayer substrate is formed by stacking a plurality of dielectric sheets provided with central electrodes or matching capacitive electrodes with each other and integrally firing the same. The matching capacitance is formed by connecting multilayer capacitive parts which are formed by stacking a number of dielectric sheets which are each partially sandwiched by a pair of capacitive electrodes in parallel with each other. An upper surface of the multilayer substrate has a first aperture for receiving a ferrite member and a second aperture for receiving a permanent magnet in positions facing the central electrodes.

Non-reciprocal circuit element

A novel, biologically active substance, poststatin, has been isolated from a culture medium of microorganism belonging to Streptomyces. The novel substance is a peptide compound having a novel structure, wherein the peptide chains have ketone radicals. Thus substance has a high endopeptidase inhibition activity. It is possible to chemically synthesize poststatin related compound having ketone radicals in the peptide chains. These compounds also have an endopeptidase inhibition activity.

Poststatin and related compounds or salts thereof

The semiconductor protection device has a p.sup.+ -n.sup.- -p-n.sup.+ layer construction, and an n type impurity diffusion region is selectively formed in a surface portion of the pn junction. This n type impurity diffusion region is formed in a linear planar portion where substantially no electric field concentration is generated when a reverse voltage is applied to the pn junction formed between the n.sup.- type semiconductor region and the p type semiconductor region. Further, an electrode is provided in ohmic contact with both of the p type semiconductor region and the n.sup.+ type semiconductor region. This electrode is selectively made in contact with the p type semiconductor region at a position remote from the n type impurity diffusion region and adjacent to a curved planar portion of the pn junction where the electric field concentration tends to occur when a reverse voltage is applied to the pn junction formed between the n.sup.- type semiconductor region and the p type semiconductor region.

Semiconductor protection device against abnormal voltage

Growing community of inventors

Tokyo, Japan

Keiji Ogawa