Sumitomo Precision Products Co., Ltd.

Sumitomo Metal Industries, Inc.

Keiji Miki

Kenji Ando

Shota Hanafusa

Chihiro Hayashi

Masayasu Kojima

Tetsuo Abiko

Toshio Nakamori

Masahiko Hori

Ryo Yamaguchi

Ken Koyama

Makoto Yoshida

Kenji Shinozaki

A heat sink includes a plurality of extrusions each including a base and a fin, the plurality of extrusions being aligned in a width direction orthogonal to an extrusion direction and joined to each other. The plurality of extrusions include a first extrusion including a plurality of fins, the first extrusion including, in the base, a through-hole in which a heat pipe is mountable, the through-hole extending in the extrusion direction.

Heat sink module with through-hole

A boiling cooler includes a boiling part, a condensing part arranged in a substantially horizontal direction with respect to the boiling part, and a connecting pipe that connects the boiling part to the condensing part. The condensing part includes a plurality of stages of refrigerant passages, a first external passage provided between the refrigerant passages, and a second external passage provided on an outer surface of at least one of an uppermost refrigerant passage and a lowermost refrigerant passage.

Boiling cooler

A cooling device includes a main body unit that has, on a surface thereof, a plurality of disposition regions where objects to be cooled are disposed, and a refrigerant flow passage provided in the main body unit. The refrigerant flow passage includes a first flow passage portion and a second flow passage portion. The first flow passage portion is formed at a predetermined position of overlapping a part of an inside of a predetermined disposition region to allow a refrigerant to pass therethrough more intensively than the second flow passage portion.

Cooling device

A heat sink which is mounted in a movable body and which is to be exposed to a traveling air stream generated while the movable body moves includes a base and a heat dissipating portion having a plurality of fins. At least in a front end portion of the heat dissipating portion, the heat dissipating portion includes a rectifying portion provided so as to extend across a predetermined area in a longitudinal direction in front portions of slit-shaped flow paths at an upstanding end (i.e., an end apart from the base).

Heat sink

With an Al&#x2014;Cu bonded structure, an Ag layer can be remained at the Al&#x2014;Cu bonding interlayer providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding characteristics. Furthermore, a thin Al&#x2014;Cu bonded structure can be obtained as a result of using the Al&#x2014;Cu dissimilar material bonded section, which has superior workability, as the base material to perform rolling for wall-thickness reduction. The thin Al&#x2014;Cu structure has superior dimensional accuracy and can meet diverse dimensional demands. The structure combines the light weight of Al with its particular heat transfer and heat dissipative characteristics and anti-corrosive properties of Cu, allowing it to meet the compact, thin, light-weight, and high-performance needs of electronic devices. The structure can be widely used in heat exchanges and heat transfer devices.

Al-Cu bonded structure and method for making the same

Galvannealed steel sheet and manufacturing method thereof

A heat sink fin assembly of the corrugated type for cooling an LSI package comprises a flat base plate and a heat dissipating member made of a thin metal sheet having convex and concave portions which are comprised of a repeated series of side wall portions, top portions, and bottom portions. The base plate and the heat dissipating member are integrated with each other by bonding.

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Amagasaki, Japan

Keiji Miki