Toagosei Company, Ltd.

Dai Nippon Printing Co., Ltd.

Keiji Maeda

Eiichi Okazaki

Shinji Hayashi

Hideo Matsuzaki

Shunsuke Sega

Hiromu Taguchi

Daisuke Kamiya

Hiroyuki Ota

Mitsutaka Hasegawa

Kuniniko Mizotani

Provided are a curable resin and a curable resin composition which have alkali-solubility and curability that can freely be adjusted and a high sensitivity, a liquid crystal panel substrate which can maintain an even cell gap, and a liquid crystal panel using the liquid crystal panel substrate to exhibit a superior display quality. A curable resin composition comprising an imide-containing copolymer having a molecular structure wherein a constitutional unit at least the following units are connected: a constitutional unit having a cyclic imide group represented by the formula (1), a constitutional unit having an acid functional group such as a carboxyl group; and a constitutional unit having a photopolymerizing functional group. In a liquid crystal panel substrate (color filter), plural spacers (column-shaped spacers) are disposed in a non-display region on a substrate

Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panel

Crosslinkable resin compositions that are cured easily by irradiation with active energy beams and particularly cured quickly with ultraviolet ray are provided, which comprises a polymer containing a maleimido group and an ethylenically unsaturated group. The composition may be an aqueous composition. They provide cured films which are excellent in durability, free from coloring and odors, and also excellent in abrasion resistance, adhesion to substrates, surface smoothness, and chemical resistance.

Crosslinkable resin compositions

A heat-sensitive adhesive sheet comprising a substrate having formed thereon an adhesive layer comprising a polymer composition (C) which comprises the following aqueous emulsion (A) and copolymer (B), wherein an adhesive force determined by the 180&deg; peeling test method as specified in JIS Z 0237 at a temperature of 25&deg; C. is 10 g/25 mm or less: Aqueous emulsion (A): An aqueous emulsion containing an alkyl (meth)acrylate-based polymer (a) having a glass transition temperature of &minus;10&deg; C. or below, which is obtained by emulsion-polymerizing radically polymerizable monomers containing as the main component an alkyl (meth)acrylate; and Copolymer (B): A water-soluble or water-dispersible copolymer (B) having a glass transition temperature of 20&deg; C. or above, which is a copolymer obtained by copolymerizing an &agr;,&bgr;-ethylenically unsaturated carboxylic acid with other radically polymerizable monomers, wherein a part or the entire amount of carboxyl groups in the copolymer is neutralized with a base having a boiling point of 110&deg; C. or below.

Heat-sensitive adhesive sheet

Growing community of inventors

Aichi, Japan

Keiji Maeda