Towa Corporation

Japan Fine Ceramics Center

Other

Japan Fine Chemicals Center

Keiji Maeda

Satoshi Kitaoka

Takaki Kuno

Naoki Kawashima

Yoshinori Noguchi

Michio Osada

Yoshihisa Kawamoto

Seiichi Suda

Masato Yoshiya

Norio Yamaguchi

Kazuhiko Bandoh

Yoshiji Shimizu

Yosinori Noguchi

Susumu Yamahara

Toshiyuki Nishimura

Shigeru Miyagawa

An upper die has a cavity member constituting an inner bottom surface of a cavity, and a surrounding member. The cavity member is formed of a low adhesion material in accordance with the present invention, and includes a body portion and a surface layer formed on an undersurface of the body portion exposed to a fluid resin. The body portion is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer is formed of YOhaving a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion. By bonding the body portion and the surface layer at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer.

Low-adhesion material, resin molding die, and soil resistant material

A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and YOis used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.

Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material

A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.

Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material

A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.

Method of evaluating adhesion property, low-adhesion material, and mold for molding resin

A composite material used for a resin mold for forming hardened resin by hardening fluid resin is provided. The composite material comprises a first material having excellent wear resistance against the fluid resin and a second material having excellent unwettability against the fluid resin. The resin mold comprises a substrate of the first material, a large number of pores each provided to form an opening on a surface of the substrate opposite to the fluid resin and a film of the second material formed along the inner wall surface of each pore at least around the opening. Each of the large number of pores is a communicating hole connecting the surface opposite to the fluid resin and the remaining surface with each other. Therefore, releasability between a mold surface and the hardened resin and wear resistance of the composite material against the fluid resin can be improved.

Composite material and resin mold

A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 &#x3bc;m; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.

Resin mold material and resin mold

A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.

Die used for resin-sealing and molding an electronic component

In a method of coating a semiconductor wafer with a resin of the present invention, first, a semiconductor wafer is placed on a bottom surface of a cavity provided in a molding surface of a lower mold of a mold with its surface having a bump facing upward. Thereafter, a required amount of resin material is supplied to cavity, and a film for exposing the bump is applied to a molding surface of the upper one of the molds. In this state, molds are closed together. Resin material is heated to melt in cavity. Then, film is pressed against the bottom surface of cavity by a pressing member provided on the molding surface of the upper mold, so that film is abutted against a leading edge of bump in cavity. A pressure is applied to the resin in cavity through film, and the surface having the bump of semiconductor wafer is coated with resin. According to the method, pressing member is provided on the upper mold, so that melted resin does not enter a sliding portion. Accordingly, productivity of the resin-coated wafer increases and a resin-coated wafer with high quality and reliability is obtained.

Method of coating semiconductor wafer with resin and mold used therefor

A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.

Resin sealing and molding apparatus for sealing electronic parts

A fixture for fixing an annular upper air isolation member which is provided around an outer side of an upper mold section to an upper mounting plate is released, thereby rotating the air isolation member by a rotational member and fixing the same by a rotational position regulating member. An upper chase unit is exchanged through an upper opening which is defined by the upper mounting plate and the rotated air isolation member. A lower chase unit is also exchanged in a similar manner. Due to this structure, a sealing mechanism for a resin sealing/molding apparatus for electronic parts which can readily and quickly exchange a mold in response to small lot production of various types of products is provided.

Growing community of inventors

Kyoto, Japan

Keiji Maeda