Murata Manufacturing Co., Ltd.

Keiji Inoue

Tsutomu Ishige

Jun Nagai

Yasuo Ohashi

Toru Yoshikawa

Yoshiteru Ohta

Yosuo Ohashi

Tadahiro Matsumoto

A plurality of converter circuits is connected in parallel while reducing conduction loss. A converter circuit is formed on each of a plurality of circuit boards, and a plurality of types of terminal connection patterns containing power input terminal connection patterns and power output terminal connection patterns are formed on the end portions of each of the circuit boards with the disposition positions substantially matching each other. The terminal connection patterns at the same position of each circuit board are sandwiched by each of clips of a common terminal member, each of the circuit boards is laminated and fixed, and the converter circuits of each of the circuit boards are connected in parallel. The conduction path for electrically connecting the converter circuit of each circuit board becomes short, making it possible to reduce conduction loss. Also, it is possible to mount a plurality of converter circuits without increasing the occupied area of a motherboard to be mated therewith in comparison with a case in which the circuit boards are provided side-by-side.

Converter device

A plurality of module substrates have circuit boards, respectively. The circuit boards are stacked with a space therebetween, and are connected to first end portions of connecting members. The second end portions of the connecting members are connected to connecting pads disposed on a motherboard. The module substrates are thus stacked and mounted on the motherboard so as to increase the mounting density. By causing the connecting members for the upper circuit board to project further than the connecting members for the lower circuit board, the connecting members for the upper and lower circuit boards are prevented from touching each other.

Mounting structure for module substrates

A circuit module has a circuit board on which electronic components are mounted and a covering member which has a plate portion and one or more supporting portions. The supporting portions fix the plate portion parallel to the surface of the circuit board. The covering member can be chucked by a chucking device to mount the circuit module to a mother circuit board.

Circuit module and method for mounting the same

To prevent a substrate for mounting electronic components from being damaged when cores are rubbed together during assembly, a pair of core members sandwich a part of a coil pattern formed on the substrate from the top and bottom sides of the substrate, and the core members are held together by a core-combining member. A cover member is fixed to the substrate to cover the upper side of the core-combining member. Inclined ribs on the cover member raise the core-combining member by abutting against external inclined fates of leg portions of the core-combining member. A clearance thereby is formed between internal faces of a top bar portion of each core member and a surface of the substrate.

Coil apparatus and manufacturing method for the same

A core-coupling unit includes a top cover and a bottom cover each having a U-shape. The core-coupling unit clamps a pair of core members in a coupled state with the top cover and the bottom cover being coupled with each other. The top cover is provided with apertures formed in respective legs of the top cover, and the bottom cover is provided with projections formed on respective legs of the bottom cover, the projections mating with the apertures so as to prevent removal. Play-gaps are provided between each projection and respective front and rear edges of the aperture. Lips are provided on the covers for maintaining the positions of the core members in the backward and forward directions. The top and bottom covers are moved backward and forward relative to each other while the core members are clamped, whereby the core members are moved together with the respective top and bottom covers, thereby performing core-rubbing.

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Yokohama, Japan

Keiji Inoue