Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Other

Skhynix Inc.

Keiji Hosotani

Yoshiaki Asao

Tatsuya Kishi

Yusuke Kohyama

Kentaro Nakajima

Fumitaka Arai

Tomomasa Ueda

Hisanori Aikawa

Minoru Amano

Junichi Miyamoto

Hiroaki Yoda

Yoshihisa Iwata

Masatoshi Yoshikawa

Masahiko Nakayama

Takeshi Kajiyama

Keisuke Nakatsuka

Sumio Ikegawa

Masaru Toko

Nobuyuki Momo

Naoharu Shimomura

Hiroyuki Kanaya

Akihiro Nitayama

Masaki Kondo

Makoto Nagamine

Daisuke Hagishima

Masayoshi Iwayama

Shinya Naito

Yoshiaki Saito

Toshihiko Nagase

Satoshi Inaba

Shigeki Takahashi

Shinji Mori

Akira Katayama

Kazumasa Sunouchi

Atsushi Takahashi

Yuta Saito

Satoshi Seto

Jyunichi Ozeki

Hideaki Harakawa

Toru Ozaki

Mariko Habu

Ryo Fukuoka

Kouji Matsuo

Masakazu Goto

Jae Yun Yi

Motohiko Fujimatsu

Hong Ju Suh

Se Dong Kim

Hiroaki Kosako

Takayuki Kakegawa

A semiconductor memory device includes a memory cell array and a peripheral circuit. The peripheral circuit includes a plurality of first nodes disposed corresponding to a plurality of first via electrodes, a charging circuit that charges the plurality of first nodes, a discharging circuit that discharges the plurality of first nodes, an address select circuit that electrically conducts one of the plurality of first nodes with the charging circuit or the discharging circuit in response to an input address signal, a plurality of first transistors each disposed in a current path between two of the plurality of first nodes, and a plurality of amplifier circuits that are disposed corresponding to the plurality of first via electrodes and include input terminals connected to any of the plurality of first nodes and output terminals connected to any of the plurality of first via electrodes.

Semiconductor memory device

A semiconductor device includes first and second gate electrodes, a semiconductor layer between the first and second gate electrodes and extending along a first direction, a first gate insulating layer between the first gate electrode and the semiconductor layer, a second gate insulating layer between the second gate electrode and the semiconductor layer, a first insulating layer including a first region adjacent to the first gate electrode in the first direction and contacting the semiconductor layer, and a second insulating layer extending including a second region adjacent to the second gate electrode in the first direction and contacting the semiconductor layer. An interface between the first region and the semiconductor layer in a direction crossing the first direction is adjacent to the first gate electrode in the first direction.

Semiconductor device and semiconductor storage device

According to one embodiment, a semiconductor memory device includes: a first semiconductor layer; first and second insulating layers in contact with the first semiconductor layer; a second semiconductor layer in contact with the first insulating layer; a third semiconductor layer in contact with the second insulating layer; a first conductor; a third insulating layer in contact with the first conductor; a fourth insulating layer provided between the second semiconductor layer and the third insulating layer; a first charge storage layer provided between the second semiconductor layer and the fourth insulating layer; and a fifth insulating layer provided between the second semiconductor layer and the first charge storage layer. The second semiconductor layer, the first conductor, the third to fifth insulating layers, and the first charge storage layer function as a first memory cell.

According to one embodiment, a semiconductor memory device includes first and second semiconductor layers and a first conductive layer. The first and second semiconductor layers extend in a first direction. The second semiconductor layer is stacked above the first semiconductor layer in a second direction intersecting the first direction. The first conductive layer intersects the first and second semiconductor layers and extends in the second direction. The first conductive layer includes first and second portions intersecting the first and second semiconductor layers respectively. A width of the first portion in the first direction is smaller than a width of the second portion in the first direction. A thickness of the first semiconductor layer in the second direction is larger than a thickness of the second semiconductor layer in the second direction.

According to one embodiment, a semiconductor memory device includes: a first semiconductor layer including first to third portions which are arranged along a first direction and differ in position from one another in a second direction; a conductive layer including a fourth portion extending in the second direction and a fifth portion extending in the first direction; a first insulating layer between the fourth portion and the first semiconductor layer and between the fifth portion and the first semiconductor layer; a first contact plug coupled to the fourth portion; a second contact plug coupled to the first semiconductor layer in a region where the first insulating layer is formed; a first interconnect; and a first memory cell apart from the fifth portion in the first direction and storing information between the semiconductor layer and the first interconnect.

Semiconductor memory device having a memory cell and semiconductor layer

According to one embodiment, a semiconductor memory device includes: a conductive layer including a first portion and a second portion electrically coupled to the first portion; a first contact plug electrically coupled to the first portion; a first semiconductor layer; a first insulating layer between the second portion and the first semiconductor layer, and between the first portion and the first semiconductor layer; a second contact plug coupled to the first semiconductor layer in a region in which the first insulating layer is formed; a first interconnect; and a first memory cell apart from the second portion in the second direction and storing information between the first semiconductor layer and the first interconnect.

According to one embodiment, a semiconductor memory device includes: first to fifth interconnects; a semiconductor layer having one end located between the fourth interconnect and the fifth interconnect and other end connected to the first interconnect; a memory cell; a conductive layer having one end connected to the second interconnect and other end connected to the semiconductor layer; a first insulating layer provided to extend between the third and fourth interconnects and the semiconductor layer, and between the fifth interconnect and the conductive layer; an oxide semiconductor layer provided to extend between the fourth and fifth interconnects and the first insulating layer; and a second insulating layer provided to extend between the fourth and fifth interconnects and the oxide semiconductor layer.

According to one embodiment, a semiconductor memory device includes: a first interconnecting layer; a first signal line; a first memory cell that stores first information between the first interconnecting layer and the first signal line; second to fourth interconnecting layers provided above the first interconnecting layer; fifth to seventh interconnecting layers disposed apart from the second to fourth interconnecting layers; a second signal line coupled to the first signal line; a third signal line coupled to the first and second signal lines and the sixth interconnecting layer; and, first to fifth transistors.

Non-volatile semiconductor memory device

According to one embodiment, a magnetic memory device includes a first magnetic layer having a variable magnetization direction, a first non-magnetic layer provided on the first magnetic layer, and a second magnetic layer provided on the first magnetic layer and having a fixed magnetization direction and provided on the first magnetic layer. The second magnetic layer includes a non-magnetic metal including at least one of Mo (molybdenum), Ta (tantalum), W (tungsten), Hf (hafnium), Nb (niobium) and Ti (titanium).

Magnetic memory device and method of manufacturing the same

According to one embodiment, a memory includes a first MTJ element having a first area along a first plane; and second MTJ elements each having a second area along the first plane. The second area is larger than or equal to twice the first area and smaller than or equal to five times the first area. Each of the second MTJ elements includes a first ferromagnet, a second ferromagnet, and a first nonmagnet. Respective magnetizations of respective first ferromagnets of the second MTJ elements are oriented along a first direction. Respective magnetizations of respective second ferromagnets of the second MTJ elements are oriented along a second direction. One of the second MTJ elements is coupled to another one of the second MTJ elements in series or in parallel.

Memory device

According to an embodiment, a resistance change memory includes a semiconductor substrate, a transistor having a control terminal, a first terminal and a second terminal, the transistor provided on the semiconductor substrate, an insulating layer covering the transistor, a first conductive line connected to the first terminal and provided on the insulating layer, a second conductive line provided on the insulating layer, and a resistance change element connected between the second terminal and the second conductive line. The first conductive line has a width greater than a width of the second conductive line in a direction in which the first and second conductive lines are arranged.

Resistance change memory

According to one embodiment, the magnetic memory device includes a first magnetoresistive element and a second magnetoresistive element which are adjacent to each other. Each of the first and second magnetoresistive elements includes a first magnetic layer, a first non-magnetic later on the first magnetic layer, a second magnetic layer on the first non-magnetic layer, a second non-magnetic layer on the second magnetic layer, and a third magnetic layer on the second non-magnetic layer. Furthermore, the magnetic memory device further includes a fourth magnetic layer being in contact with the first and second magnetoresistive elements or in contact with conductive layers on the first and second magnetoresistive elements.

Magnetic memory device

According to one embodiment, a testing method of a memory device includes annealing the memory device, the memory device including a memory element; performing, after the annealing, to the memory element a process which sets a first magnetization orientation of a first ferromagnetic layer to be antiparallel to a second magnetization orientation of the second ferromagnetic layer; reading, after the performing of the process, data from the memory element; and determining the memory element as defective due to the second magnetization orientation being parallel to a third magnetization orientation of a third ferromagnetic layer, when data represented by the first magnetization orientation being antiparallel to the second magnetization orientation differs from the read data.

Testing method, manufacturing method, and testing device of memory device

According to one embodiment, a semiconductor memory device comprises a memory cell array. The memory cell array has a plurality of magnetic tunnel junction (MTJ) elements. Each of the MTJ elements has a first magnetic layer, a second magnetic layer and a non-magnetic layer therebetween, and a hard mask layer is arranged above the second magnetic layer. The plurality of MTJ elements have a first MTJ element having a first hard mask layer and a second MTJ element having a second hard mask layer, and a dimension of, the first hard mask layer is greater than that of the second hard mask layer.

Semiconductor memory device and manufacturing method thereof

A semiconductor storage device according to the present embodiment includes a selection element formed on a surface of a semiconductor substrate. A lower electrode is connected to the selection element. A magnetic tunnel junction element is provided on the lower electrode. An upper electrode is provided on the magnetic tunnel junction element. A growth layer is provided on the upper electrode and is composed of a conductive material and has a larger area than the upper electrode when viewed from above the surface of the semiconductor substrate. A wiring line is provided on the growth layer.

Semiconductor storage device and method of manufacturing the same

Growing community of inventors

Tokyo, Japan

Keiji Hosotani