Mitsubishi Electric Corporation

Nec Corporation

Keiji Harada

Osamu Morimoto

Shinsaku Kusube

Shinji Murata

Yuji Shirakata

Yoshikazu Tsunoda

Shigetoshi Ipposhi

Shuhei Mizutani

Yoshihiro Taniguchi

Akio Sato

Masanori Kageyama

Masaki Muramatsu

Masaki Takata

Kazushi Ikurumi

Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

Heat sink and circuit device

A cooling device to be provided is capable of being reduced in size, capable of cooling a heating component uniformly, having high radiating performance, and facilitating implementation of a work in a flat state. A first cooler body includes a first base plate and first blades. The first base plate has a first component mounting surface. A second cooler body includes a second base plate and second blades. The second base plate has a second component mounting surface. With the second cooler body maintained connected to the first cooler body, a rotary mechanism allows the second cooler body to rotate relative to the first cooler body between a state in which the first component mounting surface and the second component mounting surface are pointed to the same direction and a state in which the second blades get into gaps between the first blades without interfering with the first blades.

Cooling device, lid-equipped cooling device, case with cooling device, and inverter

An outdoor unit comprises a casing, a fan, a heat exchanger, an electrical component, a heat radiation member, and a duct. The casing is provided with an air outlet. The fan is disposed inside the casing and configured to blow air to the outside of the casing via the air outlet. The heat exchanger is disposed inside the casing at a position lower than the fan. The electrical component is disposed inside the casing at a position lower than the heat exchanger. The heat radiation member is connected to the electrical component inside the casing. The duct is configured to accommodate at least part of the heat radiation member inside the casing and extend in the vertical direction. An upper end of the duct is configured to protrude upward higher than a lower end of the heat exchanger.

Outdoor unit and air conditioner

A thin film circuit including resistor elements and capacitor elements is prepared by forming a tantalum film for capacitor on an insulating substrate, forming a tantalum film for resistor over the substrate, covering a predetermined region of the tantalum resistor film with a titanium film, heat treating a resulting assembly, removing the titanium film, and then covering the predetermined region with a metal film to provide ohmic contact therebetween.

Method of manufacturing thin film circuits

Growing community of inventors

Tokyo, Japan

Keiji Harada