Hitachi Automotive Systems, Ltd.

Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Other

Hitachi Astemo Ltd.

Hitachi Automotive Engineering Co., Ltd.

Hitachi, Ltd. and Hitachi Car Engineering Co., Ltd.

Keiji Hanzawa

Masahiro Matsumoto

Noboru Tokuyasu

Shinobu Tashiro

Takeshi Morino

Hiroshi Nakano

Ryosuke Doi

Akira Uenodan

Tsutomu Kono

Masamichi Yamada

Atsushi Miyazaki

Satoshi Shimada

Izumi Watanabe

Atsushi Inoue

Keiichi Nakada

Ryo Sato

Fumio Murabayashi

Takayuki Saito

Junichi Horie

Tatsumi Yamauchi

Hiromichi Yamada

Shinya Igarashi

Kohei Sakurai

Takayuki Yogo

Norio Ishitsuka

Satoshi Arai

Takahiro Miki

Satoshi Asano

Akihiko Saito

Akio Yasukawa

Norio Ichikawa

Yasuo Onose

Yuki Okamoto

Seikou Suzuki

Yuuki Okamoto

Atsushi Kanke

Rintaro Minamitani

Hiromu Kikawa

Takafumi Matsumura

Yasuhiro Kanamaru

Kenichi Katagishi

Seiji Kuryu

Noboru Sugiura

Kei Ueyama

Masayoshi Suzuki

Kazunori Suzuki

Hiroyasu Sukesako

Noriyuki Sakuma

Takao Sasayama

Hiroaki Hoshika

Akira Kotabe

Masayuki Miki

Shigeharu Tsunoda

Yoshihiko Akagi

Seiko Suzuki

Hiroshi Moriya

Naoki Saito

Terumi Nakazawa

Shinya Satou

Kaori Kashio

Hiroki Nakatsuchi

Tetsuo Matsukura

Takuto Okamoto

Hirokazu Fujita

Kohei Suseki

Naohiro Monma

Akihiko Saitou

Masahiro Hitachi Ltd Matsumoto

A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.

Flow sensor, method for manufacturing flow sensor and flow sensor module

A thermal airflow sensor includes a sensor element, a bonding wire, a resin, and a protective film. The sensor element has a thin-wall portion. The thin-wall portion has a heating resistor. The bonding wire is electrically connected to the sensor element. The resin covers the bonding wire. The protective film is formed on a surface of the sensor element so that the heating resistor is exposed. The protective film has at least a slit between the resin and the thin-wall portion.

Thermal airflow sensor

The present invention provides a thermal flow rate measurement device that is capable of highly accurate correction of the temperature of an intake gas flow rate using a two-dimensional correction map that stores a correction value in association with temperature and intake gas flow rate. A gas flow rate measurement device that corrects a flow rate detection signal using a correction amount in which the correction amount is a correction amount in which a position displaced from a grid point of an orthogonal grid on a correction mapA is an acquisition point, and stores positional information of the acquisition pointon the correction mapA, and, at a time of flow rate measurement, determines a reference input flow rate that refers to the correction mapA on the basis of the positional information from a flow rate detection signal, determines a reference input temperature that refers to the correction mapA on the basis of the positional information from a temperature detection signal, and determines a correction amount corresponding to an input flow rate of an input flow rate Q axis corresponding to the reference input flow rate and an input temperature of an input temperature T axis corresponding to the reference input temperature.

Gas flow rate measurement device

The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package () that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing () having an inlet trench (), a bypass passage trench on frontside (), an outlet trench (), and the like are formed through resin molding, and an outer circumferential surface of the circuit package () produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package () to the housing ().

Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting elementfor temperature detection, and a conductive metal lead framethat supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.

Thermal airflow measuring device

A thermal flowmeter circuit package having a side of a measurement surfaceof the circuit package and a flow pathat a side of the backside of measurement surfaceof a rear surface of the measurement surface, and an inflow-side end surface of the circuit package for dividing the measurement target gashas different shapes at the side of the measurement surface and at the side of the backside of measurement surface. The inflow-side end surface of the circuit package for dividing the measurement target gasis formed with a reference linedividing the measurement target gas, and an end surfaceat the side of the measurement surface with respect to the reference line and an end surfaceat the side of the backside of measurement surface with respect to the reference line are formed to be asymmetrical.

Thermal flow meter with an asymmetrical inflow-side of circuit package

In configurations in which a circuit element is connected in parallel with a resistor, it is difficult to detect a break in the two wires. A thermal flow meter includes a heating element and a temperature controlling bridge circuit that is formed of a plurality of resistors and controls the temperature of the heating element. The thermal flow meter includes: a circuit element connected in parallel with at least one resistor configuring the temperature controlling bridge circuit through two wires drawn from both ends of the resistor; a voltage detection circuit that detects that the magnitude of voltage produced between the two wires has become smaller than a first predetermined value; and a fault signal output circuit that, when it is detected at the voltage detection circuit that the. magnitude of the voltage has become smaller than the first predetermined value, outputs a signal indicating a fault.

Thermal flow meter

A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector. The thermal flow meter includes a bypass passage through which a measurement target gas flowing through a main passage flows, and a circuit package which includes a measurement circuit for measuring a flow rate of the measurement target gas flowing through the bypass passage and a temperature detecting portion for detecting a temperature of the measurement target gas. The circuit package includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion molded by the resin. The temperature detecting portion is provided in the leading end portion of the protrusion, and at least the leading end portion of the protrusion protrudes to the outside from a housing.

Thermal flow meter with a case having an external terminal for outputting an electric signal

To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element. A thermal flow meterof the present invention includes an air flow sensing portionthat detects a flow rate by performing heat transfer with a measurement target gas passing through the main passageusing a heat transfer surface, a temperature detection elementthat detects a temperature of the measurement target gas, a circuit packageobtained by connecting a processing unitthat processes signals of the air flow sensing portionand the temperature detection elementto a lead and sealing the processing unitusing a first molding resin through a first molding process, and a housingwhere the circuit packageis fixed using a second molding resin through a second molding process, wherein, in the circuit package, a thickness of a temperature detecting portionfor sealing the temperature detection elementis thinner than that of a package body portionfor sealing the processing unit

Thermal flow meter with thin resin portion sealing temperature detection element

A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.

Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and bypass passage trench

A thermal flow meter capable of measuring flow rates of a gas flowing in a forward direction and a backward direction with a high degree of accuracy is provided. A thermal flow meteraccording to the present invention includes a bypass passage configured to retrieve and flow a measurement target gasreceived from a main passageand a flow rate measurement circuitconfigured to measure a flow rate by performing heat transfer with the measurement target gas flowing in the bypass passage. In an outlet port side chamberprovided at an upstream with respect to an outlet portof the bypass passage which is formed to be open in a downstream direction in a flow direction of the measurement target gas, a guideis provided to oppose the outlet port to change a direction of a flow of the measurement target gas flowing in from the opposite side, and the outlet port and an inflow unit of the outlet port side chamber are arranged to be eccentric when they are seen in a direction along the flow direction of the measurement target gas flowing in the main passage.

Thermal flow meter capable of measuring flow rates in forward flow and reverse flow directions

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Hitachinaka, Japan

Keiji Hanzawa