Hitachi, Ltd.

Hitachi Computer Engineering Co., Ltd.

Keiji Fujikawa

Shinichi Kazui

Hideaki Sasaki

Mitsugu Shirai

Yutaka Hashimoto

Hitoshi Odashima

Makoto Matsuoka

Isamu Takaoka

Hiroo Inoue

Terumi Saitoo

Junji Narita

Yooichi Fujiwara

Yoouichi Fukuoka

Hiroyuki Doi

Takeji Shiokawa

Tetsuhiro Yokoyama

Tetsuhiro Yokayama

Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Thin electronic circuit component and method and apparatus for producing the same

In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the printed conductive material is hardened to form a first conductor layer. Subsequently, an insulating material is pattern-printed on the first conductor layer, and the printed insulating material is hardened to thereby form a first insulating layer. A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer, a second insulating layer, and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.

Printed circuit board, IC card, and manufacturing method thereof

A system for producing parts/substrate assemblies each of which includes a substrate such as a ceramic substrate and a plurality of parts such as LSIs mounted on the substrate. After the LSIs for one lot of the production have been checked for excess or deficiency, etc. by a collating device, they are formed with solder bumps and then inspected. The LSIs are automatically arranged on empty work pallets as parts kits by a kit setting apparatus, and the work pallets on each of which the corresponding LSIs have been arranged as the parts kit are moved into a stocker. A host computer gives a command for mounting the LSIs on the ceramic substrate on which they can be mounted, on the basis of information indicating the stocked pallet and information indicating the progress of the ceramic substrate. An LSI mounting apparatus reads the serial No. of the introduced ceramic substrate, and requests the stocker to deliver the work pallet on which the associated LSIs have been arranged as the parts kit.

Method of producing parts/substrate assemblies

A depositing apparatus includes a profile-following mechanism having a translational displacement mechanism portion and a rotation mechanism portion adapted to allow a head to be swung in the directions of both X and the Y axes so that the head follows a profile of the surface of workpiece smoothly around a first contact point, thereof with the workpiece, serving as a fulcrum point.

Deposition apparatus and profile-following device suitable for

System for producing parts/substrate assemblies

Growing community of inventors

Hadano, Japan

Keiji Fujikawa