Nippon Steel Chemical Co., Ltd.

Nippon Steel & Sumikin Chemical Co., Ltd.

Keiji Banno

Toshihide Senzaki

Atsuhiko Katayama

Niranjan Kumar Shrestha

A water-soluble thermally polymerizable oxetane resin composition comprises (A) a water-soluble oxetane compound and (B) at least one heteropolyacid compound selected from heteropolyacids and heteropolyacid salts. The water-soluble oxetane compound may contain one or more oxetane functional groups in the molecule and one or more alcoholic OH groups in the molecule. The heteropolyacids include phosphotungstic acid, phosphomolybdic acid, silicotungstic acid, silicomolybdic acid or mixtures thereof. The heteropolyacid salts include phosphotungstic acid salts, phosphomolybdic acid salts, silicotungstic acid salts, silicomolybdic acid salts or mixtures thereof.

Thermally polymerizable resin composition

Disclosed is a cationically polymerizable composition which shows improved storage stability and whose polymerization initiation temperature or curing temperature is controlled. In the case where the composition is thermosetting, it yields a cured product of three-dimensional structure excellent in mechanical properties, electrical properties, adhesive properties, heat resistance, moisture resistance, chemical resistance, and the like. The cationically polymerizable composition comprises a cationically polymerizable compound selected from vinyl compounds, lactones, cyclic ethers, and the like, a heteropolyacid selected from phosphotungstic acid, phosphomolybdic acid, silicotungstic acid, silicomolybdic acid, and the like as a cationic polymerization initiator, and a stabilizer selected from heteropolyacid salts as an inhibitor of cationic polymerization.

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Fukuoka, Japan

Keiji Banno