Jtekt Corporation

Koyo Seiko Company, Ltd.

Keiji Asai

Hirokazu Arai

Disclosed is a phenol resin molding material comprising 100 parts by weight of a resol type phenol resin, 40 to 100 parts by weight of an inorganic fiber, 30 to 90 parts by weight of a natural silica powder having an average particle size of 0.5 to 15 &#x3bc;m and subjected to a coupling agent treatment and 1 to 15 parts by weight of a rubber component as main components. The molding material can contain 50% by weight or more of a glass fiber and a natural silica powder having a crushed shape can be used as the natural silica powder. As a molded article produced from the resin molding material, a resin pulley is exemplified.

Phenol resin molding material and pulley molded from said molding material

A phenolic molding composition containing 40 to 100 parts by weight of inorganic fiber, 30 to 90 parts by weight of natural silica powder with a mean particle size of from 20 to 150 &mgr;m, and 1 to 15 parts by weight of a rubber component, as main components, in 100 parts by weight of resol-based phenolic resin. Preferably, the inorganic fiber contains 50% or more by weight of glass fiber. Further preferably, the natural silica powder is shaped like pulverized powder. A pulley is molded of a phenolic molding composition defined above.

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Nobeoka, Japan

Keiji Asai