Fujitsu Corporation

Keiji Arai

Kenichiro Abe

Kiyotaka Seyama

Kenji Takano

Takashi Shuto

Katsumi Uchikawa

Kenji Iida

Kazuhiko Iijima

Takanori Kobayashi

Koichi Takemata

Kouji Takamachi

Tohru Matsui

Shigemitsu Matsumoto

Naoto Maezawa

Tohru Goto

Ryo Fujita

Shuji Higuchi

Kenji Ilda

Shuntaro Takizawa

The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Wiring board manufacturing method

A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.

Multilayer printed circuit board and method of making the same

A manufacturing line including a plurality of processing sections disposed in a series for manufacturing multi-layered printed circuit boards by continuously conveying and processing boards through the plurality of processing sections, in which the plurality of processing sections have at least two specific processing sections for conducting a common type of processes, and the specific processing sections are disposed in a common area.

Manufacturing line for multi-layered printed circuit boards

An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.

Process for copper plating a wiring board

Copper plating process and wiring board

Growing community of inventors

Kawasaki, Japan

Keiji Arai