Hitachi, Ltd.

Keiichirou Nakanishi

Minoru Yamada

Akira Masaki

Masakazu Yamamoto

Tatsuya Saitoh

Hideo Suzuki

Hiroki Yamashita

Hiroyuki Itoh

Katuo Sugawara

Kuninori Imai

Hiroichi Shinohara

Kazumichi Yamamoto

Akio Takahashi

Mitsuo Usami

Kazuya Takahashi

Takahiro Daikoku

Akira Kato

Kazuji Yamada

Motoyo Wajima

Ryoichi Kajiwara

Fumiyuki Kobayashi

Satoru Ogihara

Noboru Masuda

Satoru Isomura

Tohru Kobayashi

Hirokazu Inoue

Masatoshi Watanabe

Takashi Nishida

Takao Funamoto

Masaaki Takahashi

Masahide Tokuda

Moritoshi Yasunaga

Tomohiko Shida

Katuaki Chiba

Hiroshi Wachi

Atsumi Kawata

Katsunari Shibata

Tsuneyo Chiba

Mitsuru Usui

Mituo Katou

Takeshi Matsuzaka

Mararu Osanai

Yoichi Abe

Rieko Ishida

In signal transmission lines among logic circuits employed in a semiconductor integrated circuit device, a voltage driver circuit is provided with such a wiring whose length is short, and the function of the signal receiving circuit is achieved by a logic circuit capable of responding to a voltage appearing at a terminal of the wiring. On the other hand, a source terminal of such a wiring whose length is long and whose resistance is high, is voltage-driven by the voltage driver circuit in response to the output voltage of the logic circuit. A current sense circuit is provided with a terminal of this long length wiring, which senses a current flowing through this long length wiring to be converted into a voltage. Both an output resistance of the voltage driver circuit and an input resistance of the current sense circuit are made lower than a DC resistance of this long length wiring.

Integrated circuit device having different signal transfer circuits for

A semiconductor integrated circuit device includes a plurality of integrated circuit chips and a large-sized integrated circuit element on which the plurality of integrated circuit chips are mounted. The large-sized integrated circuit element includes a logic circuit for electrically interconnecting the integrated circuit chips mounted on it. The logic circuit provided within the large-sized integrated circuit element includes a control circuit for controlling a connection relation between the integrated circuit chips mounted on the large-sized integrated circuit element. Further, the logic circuit includes buffer or latch circuits for relaying signals transmitted between the integrated circuit chips.

Semiconductor integrated circuit device and computer system using the

A power source wiring supplies power to individual electronic circuits constituting an electronic circuit device. Load circuits are connected to the power source wiring within the range of an arrival time of a voltage noise occurring in the power source wiring in a time of about a half of a pulse width of a noise current at the time of the operation of the electronic circuit. Each of these load circuits includes a series circuit of a resistance and a capacitance.

Electronic circuit device having a series connection of resistor and

A semiconductor integrated circuit device has, in one embodiment, a pair of signal transmission lines formed over and insulated from a semiconductor substrate, a first circuit formed in the semiconductor substrate and electrically connected with one end of the pair of signal transmission lines for sending an electric signal, and a second circuit formed in the semiconductor substrate and electrically connected with the other end of the pair of signal transmission lines for receiving the electric signal propagating over the transmission line pair. A control resistance is electrically connected between the pair of transmission lines at the above-mentioned other end for controlling a delay time of the signal propagating over the pair of signal transmission lines between the opposite ends of the pair of signal transmission lines.

Semiconductor integrated circuit device having a signal transmission

This invention discloses an integrated circuit device including an integrated circuit chip having logic circuits formed therein and a wiring substrate for mounting thereon the integrated circuit chip. The wiring substrate has signal wirings for connecting mutually input terminals and output terminals of the integrated circuit chip. The integrated circuit device includes signal wirings for effecting connections of the input terminals and output terminals of the same integrated circuit chip inside the wiring substrate. The logic circuits inside the same integrated circuit chip are mutually connected by signal wirings formed inside the integrated circuit chip when a wiring length is small, and are mutually connected by signal wirings formed inside the wiring substrate when the wiring length is great.

Integrated circuit device having an ic chip mounted on the wiring

Noise generated at high frequencies at the time of simultaneous switchings of logical circuits is reduced by lowering an inductance from LSI to a capacitor formed on a substrate. The capacitor is formed to ensure that an inductance from a bonding pad for the LSI loaded on the substrate to an electrode of the capacitor is 0.05 nanohenry. The lower inductance from the LSI to the capacitor allows a reduction in the amount of the noise at high frequencies among those generated in power supply system, whereby the rising time of signals is made shorter, and the speed of arithmetic operation can be increased.

Capacitor-carrying semiconductor module

A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising a thin film substrate including a signal wiring layer therein, a thick film substrate laminated together with the thin film substrate, and at least a part of signal wiring being formed as a signal wiring layer included in the thick film substrate.

Thick film and thin film composite substrate and electronic circuit

The present invention relates to a chip carrier, on which LSI chips are mounted and a chip carrier is disclosed, in which a region where power source throughholes are arranged and a region where signal throughholes are arranged are separated from each other and a coupling capacitor is formed only in the region where the power source throughholes are arranged with an intention to reduce noise.

Chip carrier

An improved integrated circuit chips cooling module in which a cooling member having an inside space through which a coolant flows is attached to each of the integrated circuit chips by pressure welding or anchoring to effect cooling, wherein the improvement comprises providing coated portions for each portion of the surface of the coolant flow system where the coolant leakage may possibly take place, the coating of said coated portions comprising an organic or inorganic high-molecular weight compound curable by reacting with the coolant to keep the latter from leakage.

Integrated circuit chips cooling module having coolant leakage

An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.

Integrated circuit device

A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).

Hybrid multilayer wiring board

A cooling structure for cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate formed with minute grooves on one of its surfaces is disposed between each integrated circuit chip and an associated cooling block and is brought into contact at a grooved surface with the integrated circuit chip through a layer of a liquid such as silicone oil interposed therebetween, thereby producing negative hydrostatic pressure by capillary action of the minute grooves. The suction plate has a thickness small enough to be bent under influence of the negative hydrostatic pressure to follow a warping of the integrated circuit chip, so that the clearance between the opposing surfaces of the suction plate and the integrated circuit chip can be minimized. Thus, an integrated circuit chip cooling device of surface-to-surface contact type operable with a low thermal resistance is provided, which can improve the maintainability and reliability without sacrificing the cooling efficiency.

Device for cooling integrated circuit chip

This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuit chips mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members and which have a resiliency which is high enough to enable the pipes to expand and contract in the direction perpendicular to the wiring substrate.

Cooling module for integrated circuit chips

A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.

Growing community of inventors

Kokubunji, Japan

Keiichirou Nakanishi